Semiconductor device

ABSTRACT

It is an object to provide a semiconductor having a novel structure. In the semiconductor device, a plurality of memory elements are connected in series and each of the plurality of memory elements includes first to third transistors thus forming a memory circuit. A source or a drain of a first transistor which includes an oxide semiconductor layer is in electrical contact with a gate of one of a second and a third transistor. The extremely low off current of a first transistor containing the oxide semiconductor layer allows storing, for long periods of time, electrical charges in the gate electrode of one of the second and the third transistor, whereby a substantially permanent memory effect can be obtained. The second and the third transistors which do not contain an oxide semiconductor layer allow high-speed operations when using the memory circuit.

TECHNICAL FIELD

The invention disclosed herein relates to a semiconductor device using a semiconductor element and a method for manufacturing the semiconductor device.

BACKGROUND ART

Storage devices using semiconductor elements are broadly classified into two categories: volatile memory devices that lose stored data when power supply stops, and non-volatile memory devices that retain stored data even when power is not supplied.

A typical example of a volatile storage device is a DRAM (dynamic random access memory). A DRAM stores data in such a manner that a transistor included in a storage element is selected and electric charge is stored in a capacitor.

When data is read from a DRAM, according to the above-described principle, electric charge in a capacitor is lost; thus, another writing operation is necessary every time data is read. Moreover, a transistor included in a storage element has a leakage current and electric charge flows into or out of the capacitor even when the transistor is not selected, so that the data holding time is short. For that reason, another writing operation (refresh operation) is necessary at predetermined intervals, and it is difficult to substantially reduce power consumption. Furthermore, since stored data is lost when power supply stops, an additional storage device using a magnetic material or an optical material is needed in order to hold the data for a long time.

Another example of a volatile storage device is an SRAM (static random access memory). An SRAM stores data by using a circuit such as a flip-flop and thus does not need refresh operation. This means that an SRAM has an advantage over a DRAM. However, cost per storage capacity is increased because a circuit such as a flip-flop is used. Moreover, as in a DRAM, stored data in an SRAM is lost when power supply stops.

A typical example of a non-volatile storage device is a flash memory. A flash memory includes a floating gate between a gate electrode and a channel formation region in a transistor and stores data by holding electric charge in the floating gate. Therefore, a flash memory has advantages in that the data holding time is extremely long (almost permanent) and refresh operation which is necessary in a volatile storage device is not needed (e.g., see Patent Document 1).

However, a gate insulating layer included in a storage element deteriorates by tunneling current generated in writing, so that the storage element stops its function after a predetermined number of writing operations. In order to reduce adverse effects of this problem, a method in which the number of writing operations for storage elements is equalized is employed, for example. However, a complicated peripheral circuit is needed to apply this method. Moreover, employing such a method does not solve the fundamental problem of lifetime. In other words, a flash memory is not suitable for applications in which data is frequently rewritten.

In addition, high voltage is necessary for injecting electric charge in the floating gate or for removing the electric charge. Further, it takes a relatively long time to inject or remove electric charge, and it is not easy to increase writing and erasing speed.

REFERENCE

-   Patent Document 1: Japanese Published Patent Application No.     S57-105889

DISCLOSURE OF INVENTION

In view of the foregoing problems, an object of one embodiment of the invention disclosed herein is to provide a semiconductor device with a novel structure in which stored data can be retained even when power is not supplied, and which does not have a limitation on the number of writing.

One embodiment of the present invention is a semiconductor device having a multilayered structure comprising a transistor formed using an oxide semiconductor, and a transistor formed using a material which is not an oxide semiconductor. As examples, the following structures can be employed.

An embodiment of the present invention is a semiconductor device including a first wiring (source line), a second wiring (bit line), a third wiring (first signal line), a fourth wiring (second signal line), and a fifth wiring (word line). A plurality of memory elements are connected in series between the first wiring and the second wiring. Each of the plurality of memory elements includes a first transistor including a first gate electrode, a first source electrode, and a first drain electrode, a second transistor including a second gate electrode, a second source electrode, and a second drain electrode, and a third transistor including a third gate electrode, a third source electrode, and a third drain electrode. The first transistor is provided over a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer. The first gate electrode and one of the second source electrode and the second drain electrode are electrically connected to each other. The first wiring (source line), the first source electrode, and the third source electrode are electrically connected to each other. The second wiring (bit line), the first drain electrode, and the third drain electrode are electrically connected to each other. The third wiring (first signal line) and the other of the second source electrode and the second drain electrode are electrically connected to each other. The fourth wiring (second signal line) and the second gate electrode are electrically connected to each other. The fifth wiring (word line) and the third gate electrode are electrically connected to each other.

In addition, another embodiment of the present invention is a semiconductor device including a first wiring, a second wiring, a third wiring, a fourth wiring, and a fifth wiring. A plurality of memory elements are connected in series between the first wiring and the second wiring. Each of the plurality of memory elements including a first transistor including a first gate electrode, a first source electrode, and a first drain electrode; a second transistor including a second gate electrode, a second source electrode, and a second drain electrode; and a capacitor. The first transistor is provided over a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer. The first gate electrode, one of the second source electrode and the second drain electrode, and one electrode of the capacitor are electrically connected to each other. The first wiring and the first source electrode are electrically connected to each other. The second wiring and the first drain electrode are electrically connected to each other. The third wiring and the other of the second source electrode and the second drain electrode are electrically connected to each other. The fourth wiring and the second gate electrode are electrically connected to each other. The fifth wiring and the other electrode of the capacitor are electrically connected to each other.

In description above, the semiconductor device may include a sixth wiring, a seventh wiring, a fourth transistor a gate electrode of which is electrically connected to the sixth wiring, and a fifth transistor a gate electrode of which is electrically connected to the seven wiring. It is preferable that the second wiring be electrically connected to the first drain electrode and the third drain electrode through the fourth transistor, and the first wiring be electrically connected to the first source electrode and the third source electrode through the fifth transistor.

In description above, the first transistor of the semiconductor device includes a channel formation region provided in the substrate including the semiconductor material, impurity regions provided so as to sandwich the channel formation region, a first gate insulating layer over the channel formation region, the first gate electrode being located over the first gate insulating layer, and the first source electrode and the first drain electrode being electrically connected to the impurity regions.

In description above, the second transistor includes the second gate electrode over the substrate including the semiconductor material, a second gate insulating layer over the second gate electrode, the oxide semiconductor layer over the second gate insulating layer, and the second source electrode and the second drain electrode electrically connected to the oxide semiconductor layer.

In description above, the third transistor includes a channel formation region provided in the substrate including the semiconductor material, impurity regions provided so as to sandwich the channel formation region, a third gate insulating layer over the channel formation region, the third gate electrode over the third gate insulating layer, and the third source electrode and the third drain electrode electrically connected to the impurity regions.

In description above, a single crystal semiconductor substrate or an SOI substrate is preferably used as the substrate including the semiconductor material. In particular, silicon is preferably used as the semiconductor material.

In description above, the oxide semiconductor layer is preferably formed using an In—Ga—Zn—O-based oxide semiconductor material. More preferably, the oxide semiconductor layer includes a crystal of In₂Ga₂ZnO₇. Moreover, the concentration of hydrogen in the oxide semiconductor layer is preferably 5×10¹⁹ atoms/cm³ or less. In addition, the off-state current of the second transistor is preferably 1×10⁻¹³ A or less.

In any of the above structures, the second transistor can be provided in a region overlapping with the first transistor.

Note that in this specification, the terms such as “over” or “below” do not necessarily mean that a component is placed “directly on” or “directly under” another component. For example, the expression “a first gate electrode over a gate insulating layer” does not exclude the case where a component is placed between the gate insulating layer and the gate electrode. Moreover, the terms such as “over” and “below” are only used for convenience of description and can include the case where the relation of components is reversed, unless otherwise specified.

In addition, in this specification, the term such as “electrode” or “wiring” does not limit a function of a component. For example, an “electrode” is sometimes used as part of a “wiring”, and vice versa. Furthermore, the term “electrode” or “wiring” can include the case where a plurality of “electrodes” or “wirings” are formed in an integrated manner.

Functions of a “source” and a “drain” are sometimes replaced with each other when a transistor of opposite polarity is used or when the direction of current flowing is changed in circuit operation, for example. Therefore, the terms “source” and “drain” can be replaced with each other in this specification.

Note that in this specification, the term “electrically connected” includes the case where components are connected through an object having any electric function. There is no particular limitation on an object having any electric function as long as electric signals can be transmitted and received between components that are connected through the object.

Examples of an object having any electric function are a resistor, an inductor, a capacitor, a switching element such as a transistor, and an element with a variety of functions as well as an electrode and a wiring.

In general, the term “SOT substrate” means a substrate where a silicon semiconductor layer is provided on an insulating surface. In this specification, the term “SOT substrate” also includes in its category a substrate where a semiconductor layer formed using a material which is not silicon is provided over an insulating surface. That is, a semiconductor layer included in the “SOT substrate” is not limited to a silicon semiconductor layer. A substrate in the “SOT substrate” is not limited to a semiconductor substrate such as a silicon wafer and can be a non-semiconductor substrate such as a glass substrate, a quartz substrate, a sapphire substrate, or a metal substrate. In other words, the “SOT substrate” also includes in its category a conductive substrate with an insulating surface, or an insulating substrate, provided with a layer formed of a semiconductor material. In addition, in this specification, the term “semiconductor substrate” means not only a substrate formed using only a semiconductor material but also all substrates including a semiconductor material. That is, in this specification, the “SOT substrate” is also included in the category of the “semiconductor substrate”.

One embodiment of the present invention provides a semiconductor device in which a transistor including a material which is not an oxide semiconductor is placed in a lower portion and a transistor including an oxide semiconductor is placed in an upper portion.

Since the off-state current of a transistor including an oxide semiconductor is extremely low, stored data can be stored for an extremely long time by using the transistor. In other words, power consumption can be adequately reduced because refresh operation becomes unnecessary or the frequency of refresh operation can be extremely low. Moreover, stored data can be stored for a long time even when power is not supplied.

Further, a high voltage being not necessary to write data, deterioration of the element does not become a problem. Furthermore, data is written depending on the on state and the off state of the transistor, whereby high-speed operation can be easily realized. In addition, there is no need of operation for erasing data.

Since a transistor including a material which is not an oxide semiconductor can operate at high speed when compared to a transistor using an oxide semiconductor, stored data can be read out at high speed by using the transistor including a material which is not an oxide semiconductor.

A semiconductor device with a novel feature can be realized by including both the transistor including a material which is not an oxide semiconductor and the transistor including an oxide semiconductor.

BRIEF DESCRIPTION OF DRAWINGS

In the accompanying drawings:

FIG. 1 is a circuit diagram for illustrating a semiconductor device;

FIGS. 2A and 2B are respectively a cross-sectional view and a plan view for illustrating a semiconductor device;

FIGS. 3A to 3H are cross-sectional views illustrating steps for manufacturing a semiconductor device;

FIGS. 4A to 4G are cross-sectional views illustrating steps for manufacturing a semiconductor device;

FIGS. 5A to 5D are cross-sectional views illustrating steps for manufacturing a semiconductor device;

FIG. 6 is a cross-sectional view for illustrating a semiconductor device;

FIGS. 7A and 7B are cross-sectional views each illustrating a semiconductor device;

FIGS. 8A and 8B are cross-sectional views each illustrating a semiconductor device;

FIGS. 9A and 9B are cross-sectional views each illustrating a semiconductor device;

FIG. 10 is a circuit diagram for illustrating a semiconductor device;

FIG. 11 is a block circuit diagram for illustrating operation of a semiconductor device;

FIG. 12 is a timing chart of writing operation for illustrating a semiconductor device;

FIG. 13 is a circuit diagram for illustrating a semiconductor device;

FIG. 14 is a block circuit diagram for illustrating a semiconductor device;

FIG. 15 is a circuit diagram for illustrating a semiconductor device;

FIG. 16 is a block circuit diagram for illustrating a semiconductor device;

FIG. 17 is a graph illustrating a relation of potentials of a node A and a fifth wiring;

FIG. 18 is a circuit diagram for illustrating a semiconductor device;

FIG. 19 is a circuit diagram for illustrating a semiconductor device;

FIG. 20 is a circuit diagram for illustrating a semiconductor device;

FIGS. 21A to 21F each illustrate an electronic device;

FIG. 22 is a longitudinal cross-sectional view of an inverted staggered transistor including an oxide semiconductor;

FIGS. 23A and 23B are energy band diagrams (schematic diagrams) of a cross section A-A′ in FIG. 22;

FIG. 24A illustrates a state in which a positive potential (+V_(G)) is applied to a gate (G1), and FIG. 24B illustrates a state in which a negative potential (−V_(G)) is applied to the gate (G1); and

FIG. 25 illustrates a relation between vacuum level, work function (φ_(M)) of a metal, and electron affinity (χ) of an oxide semiconductor.

BEST MODE FOR CARRYING OUT THE INVENTION

Examples of embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the present invention is not limited to the following descriptions, and it is easily understood by those skilled in the art that modes and details disclosed herein can be modified in various ways without departing from the spirit and the scope of the present invention. Therefore, the present invention is not to be construed as being limited to the content of the embodiments included herein.

Note that the position, the size, the range, or the like of each structure illustrated in drawings and the like is not accurately represented in some cases for easy understanding. Therefore, embodiments of the present invention are not necessarily limited to a specific position, size, range, or the like disclosed in the drawings and the like.

In this specification, ordinal numbers such as “first”, “second”, and “third” are used in order to avoid confusion among components, and the terms do not mean limitation of the number of components.

Embodiment 1

In this embodiment, a structure and a manufacturing method of a semiconductor device according to one embodiment of the invention disclosed herein will be described with reference to FIG. 1, FIGS. 2A and 2B, FIGS. 3A to 3H, FIGS. 4A to 4G, FIGS. 5A to 5D, FIG. 6, FIGS. 7A and 7B, FIGS. 8A and 8B, and FIGS. 9A and 9B.

<Circuit Configuration of a Semiconductor Device>

FIG. 1 illustrates an example of a circuit configuration of a semiconductor device. The semiconductor device includes a transistor 160 formed using a material which is not an oxide semiconductor, and a transistor 162 formed using an oxide semiconductor.

Here, a gate electrode of the transistor 160 is electrically connected to one of a source electrode and a drain electrode of the transistor 162. A first wiring SL (a 1st line, also referred to as a source line) is electrically connected to a source electrode of the transistor 160. A second wiring BL (a 2nd line, also referred to as a bit line) is electrically connected to a drain electrode of the transistor 160. A third wiring S1 (a 3rd line, also referred to as a first signal line) is electrically connected to the other of the source electrode and the drain electrode of the transistor 162. A fourth wiring S2 (a 4th line, also referred to as a second signal line) is electrically connected to a gate electrode of the transistor 162.

Since the transistor 160 including a material which is not an oxide semiconductor can operate at higher speed in comparison with the transistor including an oxide semiconductor, stored data can be read at high speed by using the transistor 160. Moreover, the transistor 162 including an oxide semiconductor has extremely low off-state current. For that reason, a potential of the gate electrode of the transistor 160 can be held for an extremely long time by turning off the transistor 162.

Writing, holding, and reading of data can be performed in the following manner, using the advantage that the potential of the gate electrode can be held.

Firstly, writing and holding of data will be described. First, a potential of the fourth wiring S2 is set to a potential at which the transistor 162 is turned on, and the transistor 162 is turned on. Thus, a potential of the third wiring S1 is supplied to the gate electrode of the transistor 160 (writing). After that, the potential of the fourth wiring S2 is set to a potential at which the transistor 162 is turned off, and the transistor 162 is turned off, whereby the potential of the gate electrode of the transistor 160 is held (holding).

Since the off-state current of the transistor 162 is extremely low, the potential of the gate electrode of the transistor 160 is held for a long time. For example, when the potential of the gate electrode of the transistor 160 is a potential at which the transistor 160 is turned on, the on state of the transistor 160 is kept for a long time. Moreover, when the potential of the gate electrode of the transistor 160 is a potential at which the transistor 160 is turned off, the off state of the transistor 160 is kept for a long time.

Secondly, reading of data will be described. When a predetermined potential (a low potential) is supplied to the first wiring SL in a state where the on state or the off state of the transistor 160 is kept as described above, a potential of the second wiring BL varies depending on the on state or the off state of the transistor 160. For example, when the transistor 160 is on, the potential of the second wiring BL becomes lower than the potential of the first wiring SL. In contrast, when the transistor 160 is off, the potential of the second wiring BL is not changed.

In such a manner, the potential of the second wiring and a predetermined potential are compared with each other in a state where data is held, whereby the data can be read.

Thirdly, rewriting of data will be described. Rewriting of data is performed in a manner similar to that of the writing and holding of data. That is, the potential of the fourth wiring S2 is set to a potential at which the transistor 162 is turned on, and the transistor 162 is turned on. Thus, a potential of the third wiring S1 (a potential for new data) is supplied to the gate electrode of the transistor 160. After that, the potential of the fourth wiring S2 is set to a potential at which the transistor 162 is turned off, and the transistor 162 is turned off, whereby the new data is stored.

In the semiconductor device according to the invention disclosed herein, data can be directly rewritten by another writing of data as described above. For that reason, erasing operation which is necessary for a flash memory or the like is not needed, so that a reduction in operation speed because of erasing operation can be prevented. In other words, high-speed operation of the semiconductor device can be realized.

Note that an n-channel transistor in which electrons are the majority carriers is used in the above description; it is needless to say that a p-channel transistor in which holes are the majority carriers can be used instead of the n-channel transistor.

<Planar Structure and Cross-sectional Structure of Semiconductor Device>

FIGS. 2A and 2B illustrate an example of a structure of the semiconductor device. FIG. 2A illustrates a cross section of the semiconductor device, and FIG. 2B illustrates a plan view of the semiconductor device. Here, FIG. 2A corresponds to a cross section along line A1-A2 and line B1-B2 in FIG. 2B. The semiconductor device illustrated in FIGS. 2A and 2B includes the transistor 160 including a material which is not an oxide semiconductor in a lower portion, and the transistor 162 including an oxide semiconductor in an upper portion. Note that the transistors 160 and 162 are n-channel transistors here; alternatively, a p-channel transistor may be used. In particular, it is easy to use a p-channel transistor as the transistor 160.

The transistor 160 includes a channel formation region 116 provided in a substrate 100 including a semiconductor material, impurity regions 114 and heavily doped regions 120 (these regions can be collectively referred to simply as impurity regions) provided so as to sandwich the channel formation region 116, a gate insulating layer 108 provided over the channel formation region 116, a gate electrode 110 provided over the gate insulating layer 108, and a source electrode or drain electrode (hereinafter referred to as a source/drain electrode) 130 a electrically connected to a first impurity region 114 on one side of the channel formation region 116 and a source/drain electrode 130 b electrically connected to a second impurity region 114 located on another side of the channel formation region 116.

A sidewall insulating layer 118 is provided on a side surface of the gate electrode 110. The sidewall insulating layer 118 are comprised between the heavily doped regions 120 formed in regions of the substrate 100, when seen from above. A metal compound region 124 is placed over the heavily doped regions 120. An element insulation insulating layer 106 is provided over the substrate 100 so as to surround the transistor 160. An interlayer insulating layer 126 and an interlayer insulating layer 128 are provided so as to cover the transistor 160. The source/drain electrode 130 a is electrically connected to a first metal compound region 124 located on the one side of the channel formation region 116, and the source/drain electrode 130 b is electrically connected to a second metal compound region 124 located on the other side of the channel formation region 116 through an opening formed in the interlayer insulating layers 126 and 128. That is, the source/drain electrode 130 a is electrically connected to a first heavily doped region 120 and to the first impurity region 114 which are on the one side of the channel formation region 116 through the first metal compound region 124 on the one side of the channel formation region 116, and the source/drain 130 b is electrically connected to a second heavily doped region 120 and the to the second impurity region 114 which are on the other side of the channel formation region 116, through second the metal compound region 124. An electrode 130 c that is formed in a manner similar to that of the source/drain electrodes 130 a and 130 b is electrically connected to the gate electrode 110.

The transistor 162 including an oxide semiconductor includes a gate electrode 136 d provided over the interlayer insulating layer 128, a gate insulating layer 138 provided over the gate electrode 136 d, an oxide semiconductor layer 140 provided over the gate insulating layer 138, and a source/drain electrode 142 a and a source/drain electrode 142 b that are provided over the oxide semiconductor layer 140 and electrically connected to the oxide semiconductor layer 140.

Here, the gate electrode 136 d is provided so as to be embedded in an insulating layer 132 formed over the interlayer insulating layer 128. Like the gate electrode 136 d, an electrode 136 a, an electrode 136 b, and an electrode 136 c are formed in contact with the source/drain electrode 130 a and the source/drain electrode 130 b of the transistor 160, and the electrode 130 c, respectively.

A protective insulating layer 144 is provided over the transistor 162 so as to be in contact with part of the oxide semiconductor layer 140. An interlayer insulating layer 146 is provided over the protective insulating layer 144. Openings that reach the source/drain electrode 142 a and the source/drain electrode 142 b are formed in the protective insulating layer 144 and the interlayer insulating layer 146. An electrode 150 d and an electrode 150 e are formed in contact with the source/drain electrode 142 a and the source/drain electrode 142 b, respectively, through the respective openings. Like the electrodes 150 d and 150 e, an electrode 150 a, an electrode 150 b, and an electrode 150 c are formed in contact with the electrode 136 a, the electrode 136 b, and the electrode 136 c, respectively, through openings provided in the gate insulating layer 138, the protective insulating layer 144, and the interlayer insulating layer 146.

Here, the oxide semiconductor layer 140 is preferably a highly purified oxide semiconductor layer from which impurities such as hydrogen are adequately removed. Specifically, the concentration of hydrogen in the oxide semiconductor layer 140 is 5×10¹⁹ atoms/cm³ or less, preferably 5×10¹⁸ atms/cm³ or less, more preferably 5×10¹⁷ atoms/cm³ or less. Moreover, the oxide semiconductor layer 140 which is highly purified by an adequate reduction in hydrogen concentration has a carrier concentration with a low value compared to a carrier concentration of a typical silicon wafer (a silicon wafer to which an impurity element such as phosphorus and boron is slightly added) (approximately 5×10¹⁴/cm³). The transistor 162 with excellent off-state current characteristics can be obtained with the use of such an oxide semiconductor that is highly purified by an adequate reduction in hydrogen concentration and becomes intrinsic or substantially intrinsic. For example, when the drain voltage Vd is +1 V or +10 V and the gate voltage Vg is in the range of −5 V to −20 V, the off-state current is 1×10⁻¹³ A or less. The oxide semiconductor layer 140 which is highly purified by an adequate reduction in hydrogen concentration is used so that the off-state current of the transistor 162 is reduced, whereby a semiconductor device with a novel structure can be realized. Note that the concentration of hydrogen in the oxide semiconductor layer 140 is measured by secondary ion mass spectrometry (SIMS).

An insulating layer 152 is provided over the interlayer insulating layer 146. An electrode 154 a, an electrode 154 b, an electrode 154 c, and an electrode 154 d are provided so as to be embedded in the insulating layer 152. The electrode 154 a is in contact with the electrode 150 a. The electrode 154 b is in contact with the electrode 150 b. The electrode 154 c is in contact with the electrode 150 c and the electrode 150 d. The electrode 154 d is in contact with the electrode 150 e.

That is, in the semiconductor device illustrated in FIGS. 2A and 2B, the gate electrode 110 of the transistor 160 and the source/drain electrode 142 a of the transistor 162 are electrically connected through the electrodes 130 c, 136 c, 150 c, 154 c, and 150 d.

<Method for Manufacturing Semiconductor Device>

Next, an example of a method for manufacturing the semiconductor device will be described. First, a method for manufacturing the transistor 160 in the lower portion will be described below with reference to FIGS. 3A to 3D, and then a method for manufacturing the transistor 162 in the upper portion will be described with reference to FIGS. 4A to 4G and FIGS. 5A to 5D.

<Method for Manufacturing Lower Transistor>

First, the substrate 100 including a semiconductor material is prepared (see FIG. 3A). As the substrate 100 including a semiconductor material, a single crystal semiconductor substrate or a polycrystalline semiconductor substrate made of silicon, silicon carbide, or the like; a compound semiconductor substrate made of silicon germanium or the like; an SOI substrate; or the like can be used. Here, an example of using a single crystal silicon substrate as the substrate 100 including a semiconductor material is described.

A protective layer 102 serving as a mask for forming an element insulation insulating layer is formed over the substrate 100 (see FIG. 3A). As the protective layer 102, an insulating layer formed using silicon oxide, silicon nitride, silicon nitride oxide, or the like can be used, for example. Note that before or after this step, an impurity element imparting n-type conductivity or an impurity element imparting p-type conductivity may be added to the substrate 100 in order to control the threshold voltage of the transistor. Phosphorus, arsenic, or the like can be used as the impurity imparting n-type conductivity in the case where the semiconductor material included in the substrate 100 is silicon. Boron, aluminum, gallium, or the like can be used as the impurity imparting p-type conductivity.

Next, part of the substrate 100 in a region that is not covered with the protective layer 102 (i.e., in an exposed region) is removed by etching, using the protective layer 102 as a mask. Thus, an isolated semiconductor region 104 is formed (see FIG. 3B). As the etching, dry etching is preferably performed, but wet etching may be performed. An etching gas and an etchant can be selected as appropriate depending on a material of a layer to be etched.

Then, an insulating layer is formed so as to cover the semiconductor region 104, and the insulating layer in a region overlapping with the semiconductor region 104 is selectively removed, so that element insulation insulating layers 106 are formed (see FIG. 3B). The insulating layer is formed using silicon oxide, silicon nitride, silicon nitride oxide, or the like. As a method for removing the insulating layer, any of etching treatment and polishing treatment such as CMP (Chemical Mechanical Polishing) can be employed. Note that the protective layer 102 is removed after the formation of the semiconductor region 104 or after the formation of the element insulation insulating layers 106.

Next, an insulating layer is formed over the semiconductor region 104, and a layer including a conductive material is formed over the insulating layer.

Because the insulating layer serves as a gate insulating layer later, the insulating layer preferably has a single-layer structure or a layered structure using a film containing silicon oxide, silicon nitride oxide, silicon nitride, hafnium oxide, aluminum oxide, tantalum oxide, or the like formed by a CVD method, a sputtering method, or the like. Alternatively, the insulating layer may be formed in such a manner that a surface of the semiconductor region 104 is oxidized or nitrided by high-density plasma treatment or thermal oxidation treatment. The high-density plasma treatment can be performed using, for example, a mixed gas of a rare gas such as He, Ar, Kr, or Xe and a gas such as oxygen, nitrogen oxide, ammonia, nitrogen, or hydrogen. There is no particular limitation on the thickness of the insulating layer; the insulating layer can have a thickness of 1 nm to 100 nm inclusive, for example.

The layer including a conductive material can be formed using a metal material such as aluminum, copper, titanium, tantalum, or tungsten. The layer including a conductive material may be formed using a semiconductor material such as polycrystalline silicon containing a conductive material. There is no particular limitation on the method for forming the layer containing a conductive material, and a variety of film formation methods such as an evaporation method, a CVD method, a sputtering method, or a spin coating method can be employed. Note that this embodiment shows an example of the case where the layer containing a conductive material is formed using a metal material.

After that, the insulating layer and the layer including a conductive material are selectively etched, so that the gate insulating layer 108 and the gate electrode 110 are formed (see FIG. 3C).

Next, an insulating layer 112 that covers the gate electrode 110 is formed (see FIG. 3C). Then, the impurity regions 114 with a shallow junction depth in the substrate 100 are formed by adding phosphorus (P), arsenic (As), or the like to the semiconductor region 104 (see FIG. 3C). Note that phosphorus or arsenic is added here in order to form an n-channel transistor; an impurity element such as boron (B) or aluminum (Al) may be added in the case of forming a p-channel transistor. With the formation of the impurity regions 114, the channel formation region 116 is formed in the semiconductor region 104 below the gate insulating layer 108 (see FIG. 3C). Here, the concentration of the impurity added can be set as appropriate; the concentration is preferably increased when the size of a semiconductor element is extremely decreased. The step in which the impurity regions 114 are formed after the formation of the insulating layer 112 is employed here; alternatively, the insulating layer 112 may be formed after the formation of the impurity regions 114.

Next, the sidewall insulating layers 118 are formed (see FIG. 3D). An insulating layer is formed so as to cover the insulating layer 112 and then subjected to highly anisotropic etching, whereby the sidewall insulating layers 118 can be formed in a self-aligned manner. At this time, it is preferable to partly etch the insulating layer 112 so that a top surface of the gate electrode 110 and top surfaces of the impurity regions 114 are exposed.

Then, an insulating layer is formed so as to cover the gate electrode 110, the impurity regions 114, the sidewall insulating layers 118, and the like. Next, phosphorus (P), arsenic (As), or the like is added to regions where the insulating layer is in contact with the impurity regions 114, so that the heavily doped regions 120 are formed (see FIG. 3E). After that, the insulating layer is removed, and a metal layer 122 is formed so as to cover the gate electrode 110, the sidewall insulating layers 118, the heavily doped regions 120, and the like (see FIG. 3E). A variety of film formation methods such as a vacuum evaporation method, a sputtering method, or a spin coating method can be employed for forming the metal layer 122. The metal layer 122 is preferably formed using a metal material that reacts with a semiconductor material included in the semiconductor region 104 to be a low-resistance metal compound. Examples of such a metal material are titanium, tantalum, tungsten, nickel, cobalt, and platinum.

Next, heat treatment is performed so that the metal layer 122 reacts with the semiconductor material. Thus, the metal compound regions 124 that are in contact with the heavily doped regions 120 are formed (see FIG. 3F). Note that when the gate electrode 110 is formed using polycrystalline silicon or the like, a metal compound region is also formed in a region of the gate electrode 110 in contact with the metal layer 122.

As the heat treatment, irradiation with a flash lamp can be employed, for example. Although it is needless to say that another heat treatment method may be used, a method by which heat treatment for an extremely short time can be achieved is preferably used in order to improve the controllability of chemical reaction in formation of the metal compound. Note that the metal compound regions are formed by reaction of the metal material and the semiconductor material and have sufficiently high conductivity. The formation of the metal compound regions can properly reduce the electric resistance and improve element characteristics. Note that the metal layer 122 is removed after the metal compound regions 124 are formed.

Then, the interlayer insulating layer 126 and the interlayer insulating layer 128 are formed so as to cover the components formed in the above steps (see FIG. 3G). The interlayer insulating layers 126 and 128 can be formed using an inorganic insulating material such as silicon oxide, silicon nitride oxide, silicon nitride, hafnium oxide, aluminum oxide, or tantalum oxide. Moreover, the interlayer insulating layers 126 and 128 can be formed using an organic insulating material such as polyimide or acrylic. Note that a two-layer structure of the interlayer insulating layer 126 and the interlayer insulating layer 128 is employed here; however, the structure of an interlayer insulating layer is not limited to this structure. After the formation of the interlayer insulating layer 128, a surface of the interlayer insulating layer 128 is preferably planarized with CMP, etching, or the like.

Then, openings that reach the metal compound regions 124 are formed in the interlayer insulating layers, and the source/drain electrode 130 a and the source/drain electrode 130 b are formed in the openings (see FIG. 3H). The source/drain electrodes 130 a and 130 b can be formed in such a manner, for example, that a conductive layer is formed in a region including the openings by a PVD (Physical Vapor Deposition) method, a CVD (Chemical Vapor Deposition) method, or the like and then part of the conductive layer is removed by etching, CMP, or the like.

Note that in the case where the source/drain electrodes 130 a and 130 b are formed by removing part of the conductive layer, the process is preferably performed so that the surfaces are planarized. For example, when a thin titanium film or a thin titanium nitride film is formed in a region including the openings and then a tungsten film is formed so as to fill the openings, unnecessary parts of the tungsten film, the titanium film, the titanium nitride film, or the like is removed and the planarity of the surface can be improved by subsequent CMP. The surface including the source/drain electrodes 130 a and 130 b is planarized in such a manner that an electrode, a wiring, an insulating layer, a semiconductor layer, and the like can be favorably formed in later steps.

Note that only the source/drain electrodes 130 a and 130 b in contact with the metal compound regions 124 are shown here; however, an electrode that is in contact with the gate electrode 110 (e.g., the electrode 130 c in FIG. 2A) and the like can also be formed in this step. There is no particular limitation on a material used for the source/drain electrodes 130 a and 130 b, and a variety of conductive materials can be used. For example, a conductive material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium can be used.

Through the above steps, the transistor 160 using the substrate 100 including a semiconductor material is formed. Note that an electrode, a wiring, an insulating layer, or the like may be further formed after the above step. When the wirings have a multi-layer structure of a layered structure including an interlayer insulating layer and a conductive layer, a highly integrated semiconductor device can be provided.

<Method for Manufacturing Upper Transistor>

Next, steps for manufacturing the transistor 162 over the interlayer insulating layer 128 will be described with reference to FIGS. 4A to 4G and FIGS. 5A to 5D. Note that FIGS. 4A to 4G and FIGS. 5A to 5D illustrate steps for manufacturing electrodes, the transistor 162, and the like over the interlayer insulating layer 128; therefore, the transistor 160 and the like placed below the transistor 162 are omitted.

First, the insulating layer 132 is formed over the interlayer insulating layer 128, the source/drain electrodes 130 a and 130 b, and the electrode 130 c (see FIG. 4A). The insulating layer 132 can be formed by a PVD method, a CVD method, or the like. The insulating layer 132 can be formed using an inorganic insulating material such as silicon oxide, silicon nitride oxide, silicon nitride, hafnium oxide, aluminum oxide, or tantalum oxide.

Next, openings that reach the source/drain electrodes 130 a and 130 b and the electrode 130 c are formed in the insulating layer 132. At this time, an opening is also formed in a region where the gate electrode 136 d is to be formed in a later step. Then, a conductive layer 134 is formed so as to fill the openings (see FIG. 4B). The openings can be formed by a method such as etching using a mask. The mask can be formed by a method such as light exposure using a photomask. Either wet etching or dry etching may be used as the etching; dry etching is preferably used in terms of microfabrication. The conductive layer 134 can be formed by a film formation method such as a PVD method or a CVD method. The conductive layer 134 can be formed using a conductive material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium or an alloy or a compound (e.g., a nitride) of any of these materials, for example.

Specifically, it is possible to employ a method in which, for example, a thin titanium film is formed in a region including the openings by a PVD method and a thin titanium nitride film is formed by a CVD method, and then, a tungsten film is formed so as to fill the openings. Here, the titanium film formed by a PVD method has a function of reducing an oxide film at the interface with a lower electrode to decrease the contact resistance with lower electrodes (here, the source/drain electrodes 130 a and 130 b, the electrode 130 c, and the like). The titanium nitride film formed after the titanium film has a barrier function of preventing diffusion of the conductive material. A copper film may be formed by a plating method after the formation of the barrier film of titanium, titanium nitride, or the like.

After the conductive layer 134 is formed, part of the conductive layer 134 is removed by etching, CMP, or the like, so that the insulating layer 132 is exposed and the electrodes 136 a, 136 b, and 136 c and the gate electrode 136 d are formed (see FIG. 4C). Note that when the electrodes 136 a, 136 b, and 136 c and the gate electrode 136 d are formed by removing part of the conductive layer 134, the process is preferably performed so that the surfaces are planarized. The surfaces of the insulating layer 132, the electrodes 136 a, 136 b, and 136 c, and the gate electrode 136 d are planarized in such a manner that an electrode, a wiring, an insulating layer, a semiconductor layer, and the like can be favorably formed in later steps.

Next, the gate insulating layer 138 is formed so as to cover the insulating layer 132, the electrodes 136 a, 136 b, and 136 c, and the gate electrode 136 d (see FIG. 4D). The gate insulating layer 138 can be formed by a CVD method, a sputtering method, or the like. The gate insulating layer 138 is preferably formed using silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, aluminum oxide, hafnium oxide, tantalum oxide, or the like. Note that the gate insulating layer 138 may have a single-layer structure or a layered structure. For example, the gate insulating layer 138 made of silicon oxynitride can be formed by a plasma CVD method using silane (SiH₄), oxygen, and nitrogen as a source gas. There is no particular limitation on the thickness of the gate insulating layer 138; the gate insulating layer 138 can have a thickness of 10 nm to 500 nm inclusive, for example. In the case of employing a layered structure, for example, the gate insulating layer 138 is preferably a stack of a first gate insulating layer having a thickness of 50 nm to 200 nm inclusive, and a second gate insulating layer with a thickness of 5 nm to 300 nm inclusive over the first gate insulating layer.

Note that an oxide semiconductor that becomes intrinsic or substantially intrinsic by removal of impurities (a highly purified oxide semiconductor) is quite susceptible to the interface energy levels and the charges trapped at the interface; therefore, when such an oxide semiconductor is used for an oxide semiconductor layer, the interface with the gate insulating layer is important. In other words, the gate insulating layer 138 that is to be in contact with a highly purified oxide semiconductor layer needs to be of high quality.

For example, the gate insulating layer 138 is preferably formed by a high-density plasma CVD method using a microwave (2.45 GHz) because the gate insulating layer 138 can be dense, have a high withstand voltage and be of high quality. When a highly purified oxide semiconductor layer and a high-quality gate insulating layer are in close contact with each other, the density of energy levels at the interface can be reduced and interface characteristics can be favorable.

It is needless to say that, even when a highly purified oxide semiconductor layer is used, another method such as a sputtering method or a plasma CVD method can be employed as long as a high-quality insulating layer can be formed as a gate insulating layer. Moreover, it is possible to use an insulating layer whose quality and characteristics of the interface with the oxide semiconductor layer are improved by heat treatment performed after the formation of the insulating layer. In any case, an insulating layer that has adequate film quality as the gate insulating layer 138 and can reduce interface level density with an oxide semiconductor layer to form a favorable interface is formed as the gate insulating layer 138.

In a gate bias-temperature stress test (BT test) at 85° C. with 2×10⁶ V/cm for 12 hours, if an impurity is added to an oxide semiconductor, a bond between the impurity and a main component of the oxide semiconductor is broken by a high electric field (B: bias) and high temperature (T: temperature), thus generating a dangling bond causing a shift of the threshold voltage (Vth).

In contrast, by reducing to a minimum impurities of an oxide semiconductor, particularly hydrogen and water, interface characteristics between the oxide semiconductor and the gate insulating layer are made favorable as described above, whereby a transistor that is stable through the BT test can be obtained.

Next, an oxide semiconductor layer is formed over the gate insulating layer 138 and processed by a method such as etching using a mask, so that the island-shaped oxide semiconductor layer 140 is formed (see FIG. 4E).

As the oxide semiconductor layer, it is preferable to use an In—Ga—Zn—O-based oxide semiconductor layer, an In—Sn—Zn—O-based oxide semiconductor layer, an In—Al—Zn—O-based oxide semiconductor layer, a Sn—Ga—Zn—O-based oxide semiconductor layer, an Al—Ga—Zn—O-based oxide semiconductor layer, a Sn—Al—Zn—O-based oxide semiconductor layer, an In—Zn—O-based oxide semiconductor layer, a Sn—Zn—O-based oxide semiconductor layer, an Al—Zn—O-based oxide semiconductor layer, an In—O-based oxide semiconductor layer, a Sn—O-based oxide semiconductor layer, or a Zn—O-based oxide semiconductor layer, which is preferably amorphous in particular. In this embodiment, as the oxide semiconductor layer, an amorphous oxide semiconductor layer is formed by a sputtering method using a target for depositing an In—Ga—Zn—O-based oxide semiconductor. Note that since crystallization of an amorphous oxide semiconductor layer can be suppressed by adding silicon to the amorphous oxide semiconductor layer, an oxide semiconductor layer may be formed by, for example, using a target containing SiO₂ of 2 wt % to 10 wt % inclusive.

As a target used for forming an oxide semiconductor layer by a sputtering method, a metal oxide target containing zinc oxide as its main component can be used, for example. Moreover, a target for depositing an oxide semiconductor containing In, Ga, and Zn (a composition ratio of In₂O₃:Ga₂O₃:ZnO=1:1:1 [mol %]) can be used, for example. Furthermore, as a target for depositing an oxide semiconductor containing In, Ga, and Zn, a target has a composition ratio of In:Ga:Zn=1:1:1 [mol %] or a composition ratio of In:Ga:Zn=1:1:2 [mol %]) may also be used. The filling rate of a target for depositing an oxide semiconductor is 90% to 100% inclusive, preferably 95% or more (e.g., 99.9%). A dense oxide semiconductor layer is formed when using a target for depositing an oxide semiconductor with a high filling rate.

The atmosphere in which the oxide semiconductor layer is formed is preferably a rare gas (typically argon) atmosphere, an oxygen atmosphere, or a mixed atmosphere containing a rare gas (typically argon) and oxygen. Specifically, it is preferable to use a gas of high purity, for example a gas from which concentrations of impurities such as hydrogen, water, a hydroxyl group, or hydride are reduced to a few ppm (preferably a few ppb).

During formation of the oxide semiconductor layer, the substrate is held in a treatment chamber maintaining a reduced pressure and the substrate temperature is set between 100° C. and 600° C. inclusive, preferably between 200° C. and 400° C. inclusive. The oxide semiconductor layer is formed while the substrate is heated, so that the impurity concentration of the oxide semiconductor layer can be reduced. Moreover, damage due to sputtering is reduced. Then, a sputtering gas from which hydrogen and water are removed is introduced into the treatment chamber from which remaining moisture is being removed, and the oxide semiconductor layer is formed using metal oxide as a target. A sorption vacuum pump is preferably used in order to remove moisture remaining in the treatment chamber. A cryopump, an ion pump, or a titanium sublimation pump can be used. An evacuation unit may be a turbo pump provided with a cold trap. In the deposition chamber that is evacuated with the cryopump, a hydrogen atom and a compound containing a hydrogen atom such as water (H₂O) (and preferably also a compound containing a carbon atom), for example, are removed, whereby the impurity concentration of the oxide semiconductor layer formed in the deposition chamber can be reduced.

The oxide semiconductor layer can be formed under the following conditions, for example: the distance between the substrate and the target is 100 mm; the pressure is 0.6 Pa; the direct-current (DC) power supply is 0.5 kW; and the atmosphere is oxygen (the flow rate ratio of oxygen is 100%). Note that it is preferable to use a pulse direct current (DC) power supply because powder substances (also referred to as particles or dust) generated in film deposition can be reduced and the thickness distribution is uniform. The thickness of the oxide semiconductor layer is 2 nm to 200 nm inclusive, preferably 5 nm to 30 nm inclusive. Note that an appropriate thickness differs depending on an oxide semiconductor material, and the thickness is set as appropriate depending on the material to be used.

Note that before the oxide semiconductor layer is formed by a sputtering method, dust on a surface of the gate insulating layer 138 is preferably removed by reverse sputtering in which an argon gas is introduced and plasma is generated. Here, the reverse sputtering is a method by which ions collide with a surface to be processed so that the surface is modified, in contrast to normal sputtering by which ions collide with a sputtering target. An example of a method for making ions collide with a surface to be processed is a method in which high-frequency voltage is applied to the surface in an argon atmosphere so that plasma is generated near a substrate. Note that an atmosphere of nitrogen, helium, oxygen, or the like may be used instead of an argon atmosphere.

As an etching method for the oxide semiconductor layer, either dry etching or wet etching may be employed. It is needless to say that dry etching and wet etching can be used in combination. The etching conditions (e.g., an etching gas or an etching solution, etching time, and temperature) are set as appropriate depending on the material so that the oxide semiconductor layer can be etched into a desired shape.

An example of an etching gas used for dry etching is a gas containing chlorine (a chlorine-based gas such as chlorine (Cl₂), boron chloride (BCl₃), silicon chloride (SiCl₄), or carbon tetrachloride (CCl₄)). Moreover, a gas containing fluorine (a fluorine-based gas such as carbon tetrafluoride (CF₄), sulfur fluoride (SF₆), nitrogen fluoride (NF₃), or trifluoromethane (CHF₃)), hydrogen bromide (HBr), oxygen (O₂), any of these gases to which a rare gas such as helium (He) or argon (Ar) is added, or the like may be used.

As the dry etching method, a parallel plate RIE (reactive ion etching) method or an ICP (inductively coupled plasma) etching method can be used. In order to etch the oxide semiconductor layer into a desired shape, etching conditions (e.g., the amount of electric power applied to a coiled electrode, the amount of electric power applied to an electrode on the substrate side, and the electrode temperature on the substrate side) are set as appropriate.

As an etchant used for wet etching, a mixed solution of phosphoric acid, acetic acid, and nitric acid, an ammonia peroxide mixture, or the like can be used. As an etchant, ITO07N (produced by KANTO CHEMICAL CO., INC.) may also be used.

Then, a first heat treatment is preferably performed on the oxide semiconductor layer. The oxide semiconductor layer can be dehydrated or dehydrogenated by the first heat treatment. The temperature of the first heat treatment is 300° C. or more and 750° C. or less, preferably 400° C. or more and less than the strain point of the substrate. For example, the substrate is introduced into an electric furnace in which a resistance heating element or the like is used and the oxide semiconductor layer 140 is subjected to heat treatment at 450° C. for one hour in a nitrogen atmosphere. The oxide semiconductor layer 140 is not exposed to the air during the heat treatment so that entry of water and hydrogen can be prevented.

The heat treatment apparatus is not limited to the electric furnace and can be an apparatus for heating an object by thermal radiation or thermal conduction from a medium such as a heated gas. For example, a rapid thermal annealing (RTA) apparatus such as a gas rapid thermal annealing (GRTA) apparatus or a lamp rapid thermal annealing (LRTA) apparatus can be used. An LRTA apparatus is an apparatus for heating an object to be processed by radiation of light (an electromagnetic wave) emitted from a lamp such as a halogen lamp, a metal halide lamp, a xenon arc lamp, a carbon arc lamp, a high pressure sodium lamp, or a high pressure mercury lamp. A GRTA apparatus is an apparatus for performing heat treatment using a high-temperature gas. As the gas, an inert gas that does not react with an object by heat treatment, for example, nitrogen or a rare gas such as argon is used.

For example, as the first heat treatment, a GRTA process may be performed as follows. The substrate is put in an inert gas that has been heated to a high temperature of 650° C. to 700° C., heated for several minutes, and taken out of the inert gas. The GRTA process enables high-temperature heat treatment for a short time. Moreover, the GRTA process can be employed even when the temperature exceeds the strain point of the substrate because due to the short time of the heat treatment.

Note that the first heat treatment is preferably performed in an atmosphere that contains nitrogen or a rare gas (e.g., helium, neon, or argon) as its main component and does not contain water, hydrogen, or the like. For example, the purity of nitrogen or a rare gas such as helium, neon, or argon introduced into a heat treatment apparatus is 6 N (99.9999%) or more, preferably 7 N (99.99999%) or more (i.e., the impurity concentration is 1 ppm or less, preferably 0.1 ppm or less).

Depending on the conditions of the first heat treatment or the material of the oxide semiconductor layer, the oxide semiconductor layer is sometimes crystallized to be microcrystalline or polycrystalline. For example, the oxide semiconductor layer sometimes becomes a microcrystalline oxide semiconductor layer having a degree of crystallization of 90% or more, or 80% or more. Further, depending on the conditions of the first heat treatment or the material of the oxide semiconductor layer, the oxide semiconductor layer may be an amorphous oxide semiconductor layer containing no crystalline component.

Furthermore, in the oxide semiconductor layer, a microcrystal (the grain size is 1 nm to 20 nm inclusive, typically 2 nm to 4 nm inclusive) is sometimes mixed in an amorphous oxide semiconductor (e.g., at a surface of the oxide semiconductor layer).

The electrical characteristics of the oxide semiconductor layer can be changed by aligning microcrystals in an amorphous semiconductor. For example, when the oxide semiconductor layer is formed using a target for depositing In—Ga—Zn—O-based oxide semiconductor, the electrical characteristics of the oxide semiconductor layer can be changed by formation of a microcrystalline portion in which crystal grains of In₂Ga₂ZnO₇ with electrical anisotropy are aligned.

Specifically, for example, when the crystal grains are arranged so that the c-axis of In₂Ga₂ZnO₇ is perpendicular to a surface of the oxide semiconductor layer, the conductivity in the direction parallel to the surface of the oxide semiconductor layer can be improved and insulating properties in the direction perpendicular to the surface of the oxide semiconductor layer can be improved. Furthermore, such a microcrystalline portion has a function of suppressing entry of an impurity such as water or hydrogen into the oxide semiconductor layer.

Note that the oxide semiconductor layer including the microcrystalline portion can be formed by heating the surface of the oxide semiconductor layer by a GRTA process. Further, the oxide semiconductor layer can be formed in a more preferred manner by using a sputtering target in which the amount of Zn is smaller than that of In or Ga.

The first heat treatment for the oxide semiconductor layer 140 can be performed on the oxide semiconductor layer that has not yet been processed into the island-shaped oxide semiconductor layer 140. In that case, after the first heat treatment, the substrate is taken out of the heating apparatus and a photolithography step is performed.

Note that the above-described first heat treatment can be referred to as dehydration treatment, dehydrogenation treatment, or the like because of its effect of dehydration or dehydrogenation on the oxide semiconductor layer 140. Such dehydration treatment or dehydrogenation treatment can be performed, for example, after the oxide semiconductor layer is formed, after a source electrode and a drain electrode are stacked over the oxide semiconductor layer 140, or after a protective insulating layer is formed over the source and drain electrodes. Such dehydration treatment or dehydrogenation treatment may be performed once or plural times.

Next, the source/drain electrode 142 a and the source/drain electrode 142 b are formed in contact with the oxide semiconductor layer 140 (see FIG. 4F). The source/drain electrodes 142 a and 142 b can be formed in such a manner that a conductive layer is formed so as to cover the oxide semiconductor layer 140 and then is selectively etched.

The conductive layer can be formed by a PVD method such as a sputtering method, or a CVD method such as a plasma CVD method. As a material for the conductive layer, an element selected from aluminum, chromium, copper, tantalum, titanium, molybdenum, or tungsten; an alloy containing any of these elements as a component; or the like can be used. Moreover, one or more materials selected from manganese, magnesium, zirconium, beryllium, or thorium may be used. Aluminum combined with one or more of elements selected from titanium, tantalum, tungsten, molybdenum, chromium, neodymium, or scandium may be used. The conductive layer can have a single-layer structure or a layered structure including two or more layers. For example, the conductive layer can have a single-layer structure of an aluminum film containing silicon, a two-layer structure in which a titanium film is stacked over an aluminum film, or a three-layer structure in which a titanium film, an aluminum film, and a titanium film are stacked in this order.

Here, ultraviolet light, KrF laser light, or ArF laser light is preferably used for light exposure in forming a mask used for etching.

The channel length (L) of the transistor is determined by a distance between a lower edge portion of the source/drain electrode 142 a and a lower edge portion of the source/drain electrode 142 b. Note that for light exposure in the case where the channel length (L) is less than 25 nm, light exposure for forming a mask is performed with extreme ultraviolet rays whose wavelength is several nanometers to several hundreds of nanometers, which is extremely short. The resolution of light exposure with extreme ultraviolet rays is high and the depth of focus is large. For these reasons, the channel length (L) of the transistor to be formed later can be in the range of 10 nm to 1000 nm, and the circuit can operate at higher speed. Moreover, the off-state current is extremely low, which prevents power consumption from increasing.

The materials and etching conditions of the conductive layer and the oxide semiconductor layer 140 are adjusted as appropriate so that the oxide semiconductor layer 140 is not removed in etching of the conductive layer. Note that in some cases, the oxide semiconductor layer 140 is partly etched in the etching step and thus has a groove portion (a recessed portion) depending on the materials and the etching conditions.

An oxide conductive layer may be formed between the oxide semiconductor layer 140 and the source/drain electrode 142 a and between the oxide semiconductor layer 140 and the source/drain electrode 142 b. The oxide conductive layer and a metal layer for forming the source/drain electrodes 142 a and 142 b can be successively formed. The oxide conductive layer can function as a source region and a drain region. The placement of such an oxide conductive layer can reduce the electrical resistance of the source region and the drain region, so that the transistor can operate at high speed.

In order to reduce the number of masks to be used and reduce the number of steps, an etching step may be performed with the use of a resist mask formed using a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. A resist mask formed with the use of a multi-tone mask has a plurality of thicknesses (has a stair-like shape) and further can be changed in shape by ashing; therefore, the resist mask can be used in a plurality of etching steps for processing different patterns. That is, a resist mask corresponding to at least two of different patterns can be formed by using a multi-tone mask. Thus, the number of light-exposure masks can be reduced and the number of corresponding photolithography steps can also be reduced, whereby a process can be simplified.

Note that plasma treatment is preferably performed with the use of a gas such as N₂O, N₂, or Ar after the above step. This plasma treatment removes water or the like adsorbed on an exposed surface of the oxide semiconductor layer. Plasma treatment may be performed using a mixed gas of oxygen and argon.

Next, the protective insulating layer 144 is formed in contact with part of the oxide semiconductor layer 140 without exposure to the air (see FIG. 4G).

The protective insulating layer 144 can be formed by a method by which impurities such as water and hydrogen are prevented from being mixed to the protective insulating layer 144, such as a sputtering method, as appropriate. The protective insulating layer 144 has a thickness of 1 nm or more. The protective insulating layer 144 can be formed using silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like. The protective insulating layer 144 can have a single-layer structure or a layered structure. The substrate temperature in forming the protective insulating layer 144 is preferably room temperature or more and 300° C. or less. The atmosphere for forming the protective insulating layer 144 is preferably a rare gas (typically argon) atmosphere, an oxygen atmosphere, or a mixed atmosphere containing a rare gas (typically argon) and oxygen.

If hydrogen is contained in the protective insulating layer 144, the hydrogen may enter the oxide semiconductor layer or extract oxygen in the oxide semiconductor layer, whereby the resistance of the oxide semiconductor layer on the backchannel side might be decreased and a parasitic channel might be formed. Therefore, it is important not to use hydrogen in forming the protective insulating layer 144 so that the oxide insulating layer 144 contains as few hydrogen as possible.

Moreover, the protective insulating layer 144 is preferably formed while water left in the treatment chamber is removed, in order that hydrogen, a hydroxyl group, or water is not contained in the oxide semiconductor layer 140 and the protective insulating layer 144.

A sorption vacuum pump is preferably used in order to remove moisture remaining in the treatment chamber. A cryopump, an ion pump, or a titanium sublimation pump can be used. An evacuation unit may be a turbo pump provided with a cold trap. In the deposition chamber that is evacuated with the cryopump, a hydrogen atom and a compound containing a hydrogen atom, such as water (H₂O), are removed, for example; thus, the impurity concentration of the protective insulating layer 144 formed in the deposition chamber can be reduced.

As a sputtering gas used for forming the protective insulating layer 144, it is preferable to use a high-purity gas from which an impurity such as hydrogen, water, a hydroxyl group, or hydride is reduced so that the concentration is a few ppm (preferably a few ppb).

Next, a second heat treatment is preferably performed in an inert gas atmosphere or an oxygen gas atmosphere (at 200° C. to 400° C. inclusive, for example, at 250° C. to 350° C. inclusive). For example, the second heat treatment is performed at 250° C. for one hour in a nitrogen atmosphere. The second heat treatment can reduce variation in electric characteristics of the transistor.

Furthermore, heat treatment may be performed at 100° C. to 200° C. for one hour to 30 hours in the air. This heat treatment may be performed at a fixed heating temperature; alternatively, the following change in the heating temperature may be conducted plural times repeatedly: the heating temperature is increased from room temperature to a temperature of 100° C. to 200° C. inclusive and then decreased to room temperature. This heat treatment may be performed under a reduced pressure before the protective insulating layer is formed. The heat treatment time can be shortened when performed under the reduced pressure. This heat treatment may be performed instead of the second heat treatment or may be performed before or after the second heat treatment, for example.

Next, the interlayer insulating layer 146 is formed over the protective insulating layer 144 (see FIG. 5A). The interlayer insulating layer 146 can be formed by a PVD method, a CVD method, or the like. The interlayer insulating layer 146 can be formed using an inorganic insulating material such as silicon oxide, silicon nitride oxide, silicon nitride, hafnium oxide, aluminum oxide, or tantalum oxide. After the formation of the interlayer insulating layer 146, a surface of the interlayer insulating layer 146 is preferably planarized with CMP, etching, or the like.

Next, openings that reach the electrodes 136 a, 136 b, and 136 c and the source/drain electrodes 142 a and 142 b are formed in the interlayer insulating layer 146, the protective insulating layer 144, and the gate insulating layer 138. Then, a conductive layer 148 is formed so as to fill the openings (see FIG. 5B). The openings can be formed by a method such as etching using a mask. The mask can be formed by a method such as light exposure using a photomask. Either wet etching or dry etching may be used as the etching; dry etching is preferably used in terms of microfabrication. The conductive layer 148 can be formed by a film formation method such as a PVD method or a CVD method. The conductive layer 148 can be formed using a conductive material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium or an alloy or a compound (e.g., a nitride) of any of these materials, for example.

Specifically, it is possible to employ a method, for example, in which a thin titanium film is formed in a region including the openings by a PVD method and a thin titanium nitride film is formed by a CVD method, and then, a tungsten film is formed so as to fill the openings. Here, the titanium film formed by a PVD method has a function of reducing an oxide film at the interface with the interlayer insulating layer 146 to decrease the contact resistance with lower electrodes (here, the electrodes 136 a, 136 b, and 136 c and the source/drain electrodes 142 a and 142 b). The titanium nitride film formed after the formation of the titanium film has a barrier function of preventing diffusion of the conductive material. A copper film may be formed by a plating method after the formation of the barrier film of titanium, titanium nitride, or the like.

After the conductive layer 148 is formed, part of the conductive layer 148 is removed by etching, CMP, or the like, so that the interlayer insulating layer 146 is exposed and the electrodes 150 a, 150 b, 150 c, 150 d, and 150 e are formed (see FIG. 5C). Note that when the electrodes 150 a, 150 b, 150 c, 150 d, and 150 e are formed by removing part of the conductive layer 148, the process is preferably performed so that the surfaces are planarized. The surfaces of the interlayer insulating layer 146 and the electrodes 150 a, 150 b, 150 c, 150 d, and 150 e are planarized in such a manner that an electrode, a wiring, an insulating layer, a semiconductor layer, and the like can be favorably formed in later steps.

Then, the insulating layer 152 is formed, and openings that reach the electrodes 150 a, 150 b, 150 c, 150 d, and 150 e are formed in the insulating layer 152. After a conductive layer is formed so as to fill the openings, part of the conductive layer is removed by etching, CMP, or the like. Thus, the insulating layer 152 is exposed and the electrodes 154 a, 154 b, 154 c, and 154 d are formed (see FIG. 5D). This step is similar to the step of forming the electrode 150 a and the like; therefore, the detailed description is not repeated.

In the case where the transistor 162 is formed by the above-described method, the hydrogen concentration of the oxide semiconductor layer 140 is 5×10¹⁹ atoms/cm³ or less and the off-state current of the transistor 162 is 1×10⁻¹³ A or less. The transistor 162 with excellent characteristics can be obtained by the application of the oxide semiconductor layer 140 that is highly purified by a sufficient reduction in hydrogen concentration as described above. Moreover, it is possible to manufacture a semiconductor device that has excellent characteristics and includes the transistor 160 formed using a material which is not an oxide semiconductor in the lower portion and the transistor 162 formed using an oxide semiconductor in the upper portion.

Note that silicon carbide (e.g., 4H-SiC) is given as a semiconductor material which can be compared with an oxide semiconductor. An oxide semiconductor and 4H-SiC have some common properties. The carrier density is one of them. The density of intrinsic carriers in an oxide semiconductor at room temperature is estimated to be approximately 10⁻⁷/cm³, while that in 4H-SiC, 6.7×10⁻¹¹/cm³, an extremely small value compared to other semiconductors. For example, when the intrinsic carrier density of an oxide semiconductor is compared with the intrinsic carrier density of silicon (approximately 1.4×10¹⁰/cm³), it can be understood well that the intrinsisc carrier density of an oxide semiconductor is significantly low.

Further, the energy band gap of an oxide semiconductor is 3.0 eV to 3.5 eV and the energy band gap of 4H-SiC is 3.26 eV. Thus, an oxide semiconductor and silicon carbide are similar in that they are both wide-gap semiconductors.

On the other hand, there is a major difference between an oxide semiconductor and silicon carbide, the process temperature. Since silicon carbide generally needs to be subjected to heat treatment at 1500° C. to 2000° C., it is difficult to form a stack of silicon carbide and a semiconductor element formed using a semiconductor material which is not silicon carbide. This is because a semiconductor substrate, the semiconductor element, or the like is damaged at such high temperatures. Meanwhile, an oxide semiconductor can be formed by heat treatment at 300° C. to 500° C. (lower than a glass transition temperature of some glasses, up to about 700° C. at most); therefore, it is possible to form an integrated circuit with the use of a semiconductor material which is not an oxide semiconductor and then to form a semiconductor element including an oxide semiconductor.

In addition, in contrast to silicon carbide, an oxide semiconductor is advantageous because a low heat-resistant substrate such as a glass substrate can be used. Moreover, an oxide semiconductor does not need to be subjected to heat treatment at high temperature, so that energy cost can be reduced as compared to silicon carbide, which is another advantage.

Although a lot of researches on properties of an oxide semiconductor have been conducted, they do not include the idea of substantially reducing the density of localized energy levels itself in an energy gap. According to an embodiment of the disclosed invention, a highly purified oxide semiconductor is formed by removing water or hydrogen that can be a cause of a localized energy level. This is based on the idea of reducing substantially a localized level itself in an energy gap. Such a highly purified oxide semiconductor enables fabrication of outstanding industrial products.

Further, it is also possible to form a more highly purified (i-type) oxide semiconductor by supplying oxygen to dangling bonds of metal atoms, the dangling bonds being generated by oxygen vacancies, and thus reducing localized levels density due to the oxygen vacancy. For example, an oxide film containing oxygen in excess is formed in close contact with a channel formation region and then oxygen is supplied to the channel formation region from the oxide film, so that the localized levels density due to oxygen vacancy can be reduced.

The origin of donors in an oxide semiconductor is attributed to a shallow level of 0.1 eV to 0.2 eV under the conduction band due to hydrogen in excess, a deep level due to shortage of oxygen, or the like. Thorough removal of hydrogen and substantial supply of oxygen for elimination of such defects would be a proper technological thought.

An oxide semiconductor is generally considered as an n-type semiconductor;

however, according to one embodiment of the invention disclosed herein, an i-type semiconductor is realized by removing impurities, particularly water and hydrogen. In this respect, it can be said that one embodiment of the invention disclosed herein includes a novel technical idea because it is different from usual i-type semiconductors, such as silicon, in that they are obtained by addition of an impurity.

<Electrical Conduction Mechanism of Transistor Including Oxide Semiconductor>

An electrical conduction mechanism of a transistor including an oxide semiconductor will be described with reference to FIG. 22, FIGS. 23A and 23B, FIGS. 24A and 24B, and FIG. 25. Note that the following description is just a consideration and does not contradict the validity of the invention.

FIG. 22 is a longitudinal cross-sectional view of a dual-gate transistor (thin film transistor) including an oxide semiconductor. An oxide semiconductor layer (OS) is provided over a gate electrode layer (GE) with a gate insulating layer (GI) therebetween, and a source electrode (S) and a drain electrode (D) are formed thereover.

FIGS. 23A and 23B are schematic diagrams of energy band structures along A-A′ in FIG. 22. FIG. 23B illustrates the case where a positive voltage (V_(D)>0) is applied to a drain and a voltage is not applied to a gate (V_(G)=0) (shown by dashed lines) and the case where a positive voltage (V_(D)>0) is applied to the drain and a positive voltage (V_(G)>0) is applied to the gate (shown by solid lines). In the case where a voltage is not applied to the gate, a carrier (electron) is not injected to the oxide semiconductor side from an electrode because of a high potential barrier, so that a current does not flow, which means an off state. On the other hand, when a positive voltage is applied to the gate, the potential barrier is lowered and thus a current flows, which means an on state.

FIGS. 24A and 24B are energy band diagrams (schematic diagrams) along B-B′ in FIG. 22. FIG. 24A illustrates a state where a positive voltage +V_(G) (V_(G)>0) is applied to the gate (GE), that is, an on state where a carrier (electron) flows between a source and a drain. FIG. 24B illustrates a state where a negative voltage −V_(G) (V_(G)>0) is applied to the gate (GE), that is, an off state (where a minority carrier does not flow).

FIG. 25 illustrates the relation between the vacuum level, the work function of metal (φ_(M)), and the electron affinity of an oxide semiconductor (χ).

Metal degenerates and the Fermi level exists in the conduction band. Meanwhile, a conventional oxide semiconductor is n-type, and the Fermi level (E) is distant from the intrinsic Fermi level (E_(i)) in the center of the band gap and is located near the conduction band. It is known that hydrogen in an oxide semiconductor partly becomes a donor and is one of the causes leading to obtention of an n-type oxide semiconductor.

In contrast, an oxide semiconductor according to an embodiment of the disclosed invention is an oxide semiconductor that is made to be intrinsic (i-type) or to be close to intrinsic in the following manner: hydrogen, which is a cause of obtaining an n-type oxide semiconductor, is removed from the oxide semiconductor by high purification, so that the oxide semiconductor includes as few an element (impurity element) other than the main component of the oxide semiconductor as possible. That is, a feature of an embodiment of the present invention is that an oxide semiconductor is made to be or be close to a highly-purified i-type (intrinsic) semiconductor not by addition of an impurity element but by elimination, as much as possible, of impurities such as hydrogen and water. Thus, the Fermi level (E_(f)) can be comparable with the intrinsic Fermi level (E_(i)).

The band gap (E_(g)) and the electron affinity (χ) of an oxide semiconductor are said to be 3.15 eV and 4.3 eV, respectively. The work function of titanium (Ti) contained in a source electrode or a drain electrode is substantially equal to the electron affinity (χ) of an oxide semiconductor. In this case, a Schottky barrier against an electron is not formed at the interface between metal and an oxide semiconductor.

That is to say, in the case where the work function of metal (φ_(M)) is equal to the electron affinity of an oxide semiconductor (χ), such an energy band diagram (schematic diagram) in FIG. 23A is shown when the metal and the oxide semiconductor are in contact with each other.

In FIG. 23B, a black dot (●) indicates an electron. When a positive potential is supplied to the drain, the electron crosses over a barrier (of height h) to be injected into the oxide semiconductor, and flows to the drain. The height of the barrier (h) depends on a gate voltage and a drain voltage. When a positive drain voltage is applied, the height of the barrier (h) is lower than the height of the barrier in FIG. 23A where a voltage is not applied, that is, half the band gap (E_(g)).

At that time, as illustrated in FIG. 24A, the electron travels in the vicinity of the interface between a gate insulating layer and the highly-purified oxide semiconductor (the bottom portion where the oxide semiconductor is stable in terms of energy).

As illustrated in FIG. 24B, when a negative potential is supplied to the gate electrode (GE), a hole which is a minority carrier does not exist substantially. Thus, the current value is substantially close to 0.

In such a manner, the oxide semiconductor layer becomes intrinsic (an i-type semiconductor) or substantially intrinsic by being highly purified so as to contain as few of an element other than its main element (i.e., an impurity element) as possible. Thus, characteristics of the interface between the oxide semiconductor and the gate insulating layer become obvious. For that reason, the gate insulating layer needs to form a favorable interface with the oxide semiconductor. Specifically, it is preferable to use the following insulating layer, for example: an insulating layer formed by a CVD method using high-density plasma generated with a power supply frequency in the range of the VHF band to the microwave band, or an insulating layer formed by a sputtering method.

When the interface between the oxide semiconductor and the gate insulating layer is made favorable while the oxide semiconductor is highly purified, in the case where the transistor has a channel width W of 1×10⁴ μm and a channel length L of 3 μm, for example, it is possible to realize an off-state current of 1×10⁻¹³ A or less and a subthreshold swing (S value) of 0.1 V/dec at room temperature (with a 100-nm-thick gate insulating layer).

The oxide semiconductor is highly purified as described above so as to contain an element other than its main element (i.e., an impurity element) as little as possible, so that the thin film transistor can operate in a favorable manner.

Modification Example

FIG. 6, FIGS. 7A and 7B, FIGS. 8A and 8B, and FIGS. 9A and 9B illustrate modification examples of structures of semiconductor devices. The semiconductor devices in each of which the transistor 162 has a structure different from that described above will be described below as modification examples. That is, the structure of the transistor 160 is the same as the above.

FIG. 6 illustrates an example of a semiconductor device including the transistor 162 in which the gate electrode 136 d is placed below the oxide semiconductor layer 140 and the source/drain electrodes 142 a and 142 b are in contact with a bottom surface of the oxide semiconductor layer 140. Note that the planar structure can be changed as appropriate to correspond to the cross section; therefore, only the cross section is shown here.

A big difference between the structure in FIG. 6 and the structure in FIG. 2A is the position at which the oxide semiconductor layer 140 is connected to the source/drain electrodes 142 a and 142 b. That is, a top surface of the oxide semiconductor layer 140 is in contact with the source/drain electrodes 142 a and 142 b in the structure in FIG. 2A, whereas the bottom surface of the oxide semiconductor layer 140 is in contact with the source/drain electrodes 142 a and 142 b in the structure in FIG. 6. Moreover, the difference in the contact position results in a different arrangement of other electrodes, an insulating layer, and the like. The details of each component are the same as those of FIGS. 2A and 2B.

Specifically, the semiconductor device illustrated in FIG. 6 includes the gate electrode 136 d provided over the interlayer insulating layer 128, the gate insulating layer 138 provided over the gate electrode 136 d, the source/drain electrodes 142 a and 142 b provided over the gate insulating layer 138, and the oxide semiconductor layer 140 in contact with top surfaces of the source/drain electrodes 142 a and 142 b.

Here, the gate electrode 136 d is provided so as to be embedded in the insulating layer 132 formed over the interlayer insulating layer 128. Like the gate electrode 136 d, the electrode 136 a, the electrode 136 b, and the electrode 136 c are formed in contact with the source/drain electrode 130 a, the source/drain electrode 130 b, and the electrode 130 c, respectively.

The protective insulating layer 144 is provided over the transistor 162 so as to be in contact with part of the oxide semiconductor layer 140. The interlayer insulating layer 146 is provided over the protective insulating layer 144. Openings that reach the source/drain electrode 142 a and the source/drain electrode 142 b are formed in the protective insulating layer 144 and the interlayer insulating layer 146. The electrode 150 d and the electrode 150 e are formed in contact with the source/drain electrode 142 a and the source/drain electrode 142 b, respectively, through the respective openings. Like the electrodes 150 d and 150 e, the electrodes 150 a, 150 b, and 150 c are formed in contact with the electrodes 136 a, 136 b, and 136 c, respectively, through openings provided in the gate insulating layer 138, the protective insulating layer 144, and the interlayer insulating layer 146.

The insulating layer 152 is provided over the interlayer insulating layer 146. The electrodes 154 a, 154 b, 154 c, and 154 d are provided so as to be embedded in the insulating layer 152. The electrode 154 a is in contact with the electrode 150 a. The electrode 154 b is in contact with the electrode 150 b. The electrode 154 c is in contact with the electrode 150 c and the electrode 150 d. The electrode 154 d is in contact with the electrode 150 e.

FIGS. 7A and 7B each illustrate an example of a structure of a semiconductor device in which the gate electrode 136 d is placed over the oxide semiconductor layer 140. FIG. 7A illustrates an example of a structure in which the source/drain electrodes 142 a and 142 b are in contact with a bottom surface of the oxide semiconductor layer 140. FIG. 7B illustrates an example of a structure in which the source/drain electrodes 142 a and 142 b are in contact with a top surface of the oxide semiconductor layer 140.

A big difference between the structures in FIGS. 7A and 7B and those in FIG. 2A and FIG. 6 is that the gate electrode 136 d is placed over the oxide semiconductor layer 140. Furthermore, a big difference between the structure in FIG. 7A and the structure in FIG. 7B is that the source/drain electrodes 142 a and 142 b are in contact with either the bottom surface or the top surface of the oxide semiconductor layer 140. Moreover, these differences result in a different arrangement of other electrodes, an insulating layer, and the like. The details of each component are the same as those of FIGS. 2A and 2B, and the like.

Specifically, the semiconductor device illustrated in FIG. 7A includes the source/drain electrodes 142 a and 142 b provided over the interlayer insulating layer 128, the oxide semiconductor layer 140 in contact with top surfaces of the source/drain electrodes 142 a and 142 b, the gate insulating layer 138 provided over the oxide semiconductor layer 140, and the gate electrode 136 d over the gate insulating layer 138 in a region overlapping with the oxide semiconductor layer 140.

The semiconductor device illustrated in FIG. 7B includes the oxide semiconductor layer 140 provided over the interlayer insulating layer 128, the source/drain electrodes 142 a and 142 b provided to be in contact with a top surface of the oxide semiconductor layer 140, the gate insulating layer 138 provided over the oxide semiconductor layer 140 and the source/drain electrodes 142 a and 142 b, and the gate electrode 136 d over the gate insulating layer 138 in a region overlapping with the oxide semiconductor layer 140.

Note that in the structures in FIGS. 7A and 7B, a component (e.g., the electrode 150 a or the electrode 154 a) can sometimes be omitted from the structure in FIGS. 2A and 2B or the like. In this case, a secondary effect such as simplification of a manufacturing process can be obtained. It is needless to say that a nonessential component can be omitted in the structures in FIGS. 2A and 2B and the like.

FIGS. 8A and 8B each illustrate an example of the case where the size of the element is relatively large and the gate electrode 136 d is placed below the oxide semiconductor layer 140. In this case, a demand for the planarity of a surface and the coverage is relatively moderate, so that it is not necessary to form a wiring, an electrode, and the like to be embedded in an insulating layer. For example, the gate electrode 136 d and the like can be formed by patterning after formation of a conductive layer. Note that although not illustrated here, the transistor 160 can be formed in a similar manner.

A big difference between the structure in FIG. 8A and the structure in FIG. 8B is that the source/drain electrodes 142 a and 142 b are in contact with either the bottom surface or the top surface of the oxide semiconductor layer 140. Moreover, these differences result in other electrodes, an insulating layer, and the like being arranged in a different manner. The details of each component are the same as those of FIGS. 2A and 2B, and the like.

Specifically, the semiconductor device illustrated in FIG. 8A includes the gate electrode 136 d provided over the interlayer insulating layer 128, the gate insulating layer 138 provided over the gate electrode 136 d, the source/drain electrodes 142 a and 142 b provided over the gate insulating layer 138, and the oxide semiconductor layer 140 in contact with top surfaces of the source/drain electrodes 142 a and 142 b.

The semiconductor device illustrated in FIG. 8B includes the gate electrode 136 d provided over the interlayer insulating layer 128, the gate insulating layer 138 provided over the gate electrode 136 d, the oxide semiconductor layer 140 provided over the gate insulating layer 138 overlapping with the gate electrode 136 d, and the source/drain electrodes 142 a and 142 b provided to be in contact with a top surface of the oxide semiconductor layer 140.

Note that also in the structures in FIGS. 8A and 8B, a component can sometimes be omitted from the structure in FIGS. 2A and 2B or the like. Also in this case, a secondary effect such as simplification of a manufacturing process can be obtained.

FIGS. 9A and 9B each illustrate an example of the case where the size of the element is relatively large and the gate electrode 136 d is placed over the oxide semiconductor layer 140. Also in this case, a demand for the planarity of a surface and the coverage is relatively moderate, so that it is not necessary to form a wiring, an electrode, and the like to be embedded in an insulating layer. For example, the gate electrode 136 d and the like can be formed by patterning after formation of a conductive layer. Note that although not illustrated here, the transistor 160 can be formed in a similar manner.

A big difference between the structure in FIG. 9A and the structure in FIG. 9B is that the source/drain electrodes 142 a and 142 b are in contact with either the bottom surface or the top surface of the oxide semiconductor layer 140. Moreover, this difference results in other electrodes, an insulating layer, and the like being arranged in a different manner. The details of each component are the same as those of FIGS. 2A and 2B, and the like.

Specifically, the semiconductor device illustrated in FIG. 9A includes the source/drain electrodes 142 a and 142 b provided over the interlayer insulating layer 128, the oxide semiconductor layer 140 in contact with top surfaces of the source/drain electrodes 142 a and 142 b, the gate insulating layer 138 provided over the source/drain electrodes 142 a and 142 b and the oxide semiconductor layer 140, and the gate electrode 136 d provided over the gate insulating layer 138 in a region overlapping with the oxide semiconductor layer 140.

The semiconductor device illustrated in FIG. 9B includes the oxide semiconductor layer 140 provided over the interlayer insulating layer 128, the source/drain electrodes 142 a and 142 b provided to be in contact with a top surface of the oxide semiconductor layer 140, the gate insulating layer 138 provided over the source/drain electrodes 142 a and 142 b and the oxide semiconductor layer 140, and the gate electrode 136 d provided over the gate insulating layer 138 in a region overlapping with the oxide semiconductor layer 140.

Note that also in the structures in FIGS. 9A and 9B, a component can sometimes be omitted from the structure in FIGS. 2A and 2B or the like. Also in this case, a secondary effect such as simplification of a manufacturing process can be obtained.

As described above, a semiconductor device with a novel structure can be realized according to one embodiment of the invention disclosed herein. In this embodiment, the examples in each of which the semiconductor device is formed by stacking the transistor 160 and the transistor 162 are described; however, the structure of the semiconductor device is not limited to this structure. Moreover, this embodiment shows the examples in each of which the channel length direction of the transistor 160 is perpendicular to that of the transistor 162; however, the positional relation between the transistors 160 and 162 is not limited to this example. In addition, the transistor 160 and the transistor 162 may be provided to overlap with each other.

In this embodiment, the semiconductor device with a minimum storage unit (one bit) is described for simplification; however, the structure of the semiconductor device is not limited thereto. A more advanced semiconductor device can be formed by connecting a plurality of semiconductor devices as appropriate. For example, a NAND-type or NOR-type semiconductor device can be formed by using a plurality of the above-described semiconductor devices. The wiring configuration is not limited to that in FIG. 1 and can be changed as appropriate.

The semiconductor device according to this embodiment can store data for an extremely long time because the transistor 162 has low off-state current. That is, refresh operation which is necessary in a DRAM and the like is not needed, so that power consumption can be suppressed. Moreover, the semiconductor device according to this embodiment can be used as a substantially non-volatile memory device.

Since writing or the like of data is performed with switching operation of the transistor 162, high voltage is not necessary and deterioration of the element does not become a problem. Furthermore, data is written and erased depending on on state and off state of the transistor, whereby high-speed operation can be easily realized. In addition, it is possible to rewrite data directly by controlling a potential input to the transistor. Therefore, erasing operation which is necessary in a flash memory and the like is not necessary in the present invention, so that a reduction in operation speed because of erasing operation can be prevented.

Since a transistor including a material which is not an oxide semiconductor can operate at further high speed in comparison with a transistor including an oxide semiconductor, stored data can be read out at high speed by using the transistor including a material which is not an oxide semiconductor.

The structures and methods described in this embodiment can be combined as appropriate with any of the structures and methods described in the other embodiments.

Embodiment 2

In this embodiment, a circuit configuration of a semiconductor device according to one embodiment of the present invention and an operation method thereof will be described.

FIG. 10 illustrates an example of a circuit diagram of a memory element (hereinafter, also referred to as a memory cell) included in the semiconductor device. A memory cell 200 illustrated in FIG. 10 includes a third wiring S1 (a first signal line), a fourth wiring S2 (a second signal line), a fifth wiring WL (a word line), a transistor 201, a transistor 202, and a transistor 203. The transistor 201 and the transistor 203 are formed using a material which is not an oxide semiconductor and the transistor 202 is formed using an oxide semiconductor. Here, the transistor 201 and the transistor 203 are preferably formed to have a structure similar to that of the transistor 160 in Embodiment 1. In addition, the transistor 202 is preferably formed to have a structure similar to that of the transistor 162 in Embodiment 1. Further, the memory cell 200 is electrically connected to the first wiring SL (the source line) and the second wiring BL (the bit line), preferably through a transistor (including a transistor included in another memory cell).

Here, a gate electrode of the transistor 201 is electrically connected to one of a source electrode and a drain electrode of the transistor 202. In addition, the first wiring SL is electrically connected to a source electrode of the transistor 201 and a source electrode of the transistor 203, and the second wiring BL is electrically connected to a drain electrode of the transistor 201 and a drain electrode of the transistor 203. Moreover, the third wiring S1, the fourth wiring S2, and the fifth wiring WL are electrically connected to the other of the source electrode and the drain electrode of the transistor 202, a gate electrode of the transistor 202, and a gate electrode of the transistor 203, respectively. Note that the first wiring SL may be electrically connected to the source electrode of the transistor 201 and to a source electrode of the transistor 203 through a transistor (including a transistor in another memory cell). Furthermore, the second wiring BL may be electrically connected to the drain electrode of the transistor 201 and to the drain electrode of the transistor 203 through a transistor (including a transistor in another memory cell).

FIG. 11 illustrates a block circuit diagram of a semiconductor device according to one embodiment of the present invention, which includes m×n bits of memory capacitance. Here, as an example, a NAND semiconductor device in which the memory cells 200 are connected in series is shown.

The semiconductor device according to one embodiment of the present invention includes m fifth wirings WL(1) to W(m), m fourth wirings S2(1) to S2(m), n first wirings SL(1) to SL(n), n second wirings BL(1) to BL(n), n third wirings S1(1) to S1(n), two sixth wirings SEL(1) and SEL(2), a memory cell array 210 in which a plurality of memory cells 200 (1, 1) to 200 (m, n) are provided in matrix of m rows (horizontal) and n columns (vertical) (m and n are natural numbers), transistors 215 (1, 1) to 215 (1, n) provided respectively between the second wirings BL(1) to BL(n) and the memory cells 200 (1, 1) to 200 (1, n) along the sixth wiring SEL(1), transistors 215 (2, 1) to 215 (2, n) provided respectively between the first wirings SL(1) to SL(n) and the memory cells 200 (m, 1) to 200 (m, n) along the sixth wiring SEL(2), and peripheral circuits such as a driver circuit 211 of the second wiring and the third wiring, a driver circuit 213 of the fourth wiring and the fifth wiring, and a reading circuit 212. A refresh circuit or the like may be provided as another peripheral circuit.

Each memory cell 200 (a specific example of which is the memory cell 200 (i, j), where i is an integer of 1 or more and m or less, and j is an integer of 1 or more and n or less) is connected to the third wiring S1(j), the fourth wiring S2(i), and the fifth wiring WL(i). Further, the drain electrodes of the transistors 201 and 203 included in the memory cell 200 (i₁, j) (i₁ is an integer of 2 to m) are connected to the source electrodes of the transistors 201 and 203 included in the memory cell 200 (i_(j)−1, j). In addition, the source electrodes of the transistors 201 and 203 included in the memory cell 200 (i₂, j) (i₂ is an integer of 1 to m−1) are connected to the drain electrodes of the transistors 201 and 203 included in the memory cell 200 (i₂+1, j). The drain electrodes of the transistors 201 and 203 included in the memory cell 200 (1, j) are connected to a source electrode of the transistor 215 (1, j). The source electrodes of the transistors 201 and 203 included in the memory cell 200 (m, j) are connected to a drain electrode of the transistor 215 (2, j). The drain electrode of the transistor 215 (1, j) is connected to the second wiring BL(j). The source electrode of the transistor 215 (2, j) is connected to the first wiring SL(j). A gate electrode of the transistor 215 (1, j) is connected to the sixth wiring SEL(1). The gate electrode of the transistor 215 (2, j) is connected to the sixth wiring SEL(2).

Further, the second wirings BL(1) to BL(n) and the third wirings S1(1) to S1(n) are connected to the driver circuit 211 of the second wiring and the third wiring. The fifth wirings WL(1) to WL(m), the fourth wirings S2(1) to S2(m), and the sixth wirings SEL(1) and SEL(2) are connected to the driver circuit 213 of the fourth wiring and the fifth wiring. In addition, the second wirings BL(1) to BL(n) are also connected to the reading circuit 212. A potential Vs is supplied to the first wirings SL(1) to SL(n). Note that the first wirings SL(1) to SL(n) are not necessarily separated and may be connected to each other.

The operation of the semiconductor device illustrated in FIG. 11 will be described. In this structure, writing and reading are performed by row.

When writing is performed on the memory cells 200 (i, 1) to 200 (i, n) in the i-th row, the fourth wiring S2(i) is supplied with 2 V in order to turn on the transistors 202 of the selected memory cells. On the other hand, the fourth wirings S2 except the fourth wiring S2(i) are supplied with 0 V in order to turn off the transistors 202 of the non-selected memory cells. Among the third wirings S1(1) to S1(n), a wiring of a column through which data “1” is written is supplied with 2 V while a column through which data “0” is supplied with 0 V. Note that, to finish writing, the fourth wiring S2(i) is supplied with 0 V before the potentials of the third wirings S1(1) to S1(n) are changed, so that the transistors 202 of the selected memory cells are turned off. As for the other wirings, for example, the potentials of the second wirings BL(1) to BL(n), the potentials of the fifth wirings WL(1) to WL (m), the potentials of the sixth wirings SEL(1) and SEL(2), and the potential Vs of the first wirings SL(1) to SL(n) are set to 0. An example of a timing chart of writing operation is illustrated in FIG. 12.

As a result, the potential of a node (hereinafter, referred to as a node A) connected to the gate electrode of the transistor 201 of the memory cell to which the data “1” has been written is approximately 2 V, and the potential of the node A of the memory cell to which the data “0” has been written is approximately 0 V. The potential of the node A of the non-selected memory cell is not changed. Here, the off-state current of the transistor 202 is extremely small or substantially zero, so that the potential of the gate electrode of the transistor 201 (node A) is held for a long time.

When reading is performed on the memory cells 200 (i, 1) to 200 (i, n) in the i-th row, the sixth wirings SEL(1) and SEL(2) are supplied with 2 V in order to turn on the transistors 215 (1, 1) to 215 (2, n). The potential Vs of the first wirings SL(1) to SL(n) is set to 0. The reading circuit 212 connected to the second wirings BL(1) to BL(n) is set to operate. The fourth wirings S2(1) to S2(m) are supplied with 0 V in order to turn off the all of the transistors 202 of the memory cells. The third wirings S1(1) to S1(n) are supplied with 0 V.

Then, the fifth wiring WL(i) is supplied with 0 V, and the fifth wirings WL except the fifth wiring WL(i) are supplied with 2 V. At this time, the transistors 203 of the memory cells in the i-th row are turned off. The transistors 203 of the memory cells which are not in the i-th row are turned on. As a result, the resistance state of the column of memory cells is determined by whether the state of the transistor 201 of the memory cells in the i-th row is in an on state or an off state. In the memory cell which has the data “0” in the i-th row, the transistor 201 is turned off because the node A is supplied with approximately 0 V; therefore, the resistance of the memory cell column is high (hereinafter, also referred to as “the memory cell column is in a high-resistance state”). On the other hand, in the memory cell which has the data in the i-th row, the transistor 201 is turned on because the node A is supplied with approximately 2 V; therefore, the resistance of the memory cell column is low (hereinafter, also referred to as “the memory cell column is in a low-resistance state”). As a result, the reading circuit can read the data “0” and “1” by difference of the resistance states of the memory cells.

Note that in writing, in the case where the semiconductor device does not have a substrate potential such as the case where thin film transistor is formed over an SOI substrate, it is preferable that the fifth wirings WL(i+1) to WL(m) and the sixth wiring SEL(2) be supplied with 2 V. Thus, at least one of the source electrode and the drain electrode of the transistor 201 of the memory cell in the i-th row can be supplied with approximately 0 V. Alternatively, the sixth wiring SEL(1) and the fifth wirings WL(1) to WL(i−1) can be supplied with 2 V. On the other hand, in the case where the semiconductor device has a substrate potential such as the case where a transistor is formed over a single crystal semiconductor substrate, the substrate potential may be set to be 0 V.

Note that the second wirings BL(1) to BL(n) are supplied with 0 V in writing in the above description; however, the second wirings BL(1) to BL(n) may be in a floating state or charged to have a potential of 0 V or more in the case where the sixth wiring SEL(1) is supplied with 0 V. The third wirings S1(1) to S1(n) are supplied with 0 V in reading; however, the third wirings S1(1) to S1(n) may be in a floating state or charged to have a potential of 0 V or more.

Note that the data “1” and the data “0” are defined for convenience and can be reversed. In addition, the above operation voltages are an example. An operation voltage may be determined so that the transistor 201 is in an off state when the data “0” is set to and in an on state when the data “1” is set to, so that the 202 is in an on state in writing and in an off state otherwise, or so that the transistor 203 of the selected memory cell is in an off state in reading, and the transistor 203 of the non-selected memory cell is in an on state in reading. The power supply potential VDD of the peripheral logic circuit may be used instead of 2 V. In addition, the ground potential GND may be used instead of 0 V.

Next, another example of a circuit configuration of a semiconductor device according to one embodiment of the present invention and operation thereof will be described.

FIG. 13 illustrates an example of a memory cell circuit included in a semiconductor device. A memory cell 220 in FIG. 13 includes the third wiring S1, the fourth wiring S2, the fifth wiring WL, the transistor 201, the transistor 202, and the transistor 203. The transistor 201 and the transistor 203 are formed using a material which is not an oxide semiconductor and the transistor 202 is formed using an oxide semiconductor. Here, the transistor 201 and the transistor 203 are preferably formed to have a structure similar to that of the transistor 160 in Embodiment 1. In addition, the transistor 202 is preferably formed to have a structure similar to that of the transistor 162 in Embodiment 1. Further, it is preferable that the memory cell 220 be electrically connected to the first wiring SL and the second wiring BL through a transistor (including a transistor in another memory cell).

The memory cell circuit in FIG. 13 is different from the memory cell circuit in FIG. 10 in the directions of the third wiring S1 and the fourth wiring S2. In other words, the memory cell circuit in FIG. 13 has a structure in which the fourth wiring S2 and the third wiring S1 are provided along the second wiring BL (in a column direction) and the fifth wiring WL (in a row direction), respectively.

FIG. 14 illustrates a block circuit diagram of a semiconductor device according to one embodiment of the present invention, which includes m×n bits of memory capacitance. Here, as an example, a NAND semiconductor device in which the memory cells 220 are connected in series is shown.

The semiconductor device according to one embodiment of the present invention includes m fifth wirings WL, m third wirings S1, n first wirings SL, n second wirings BL, n fourth wirings S1, two sixth wirings SEL, a memory cell array 230 in which a plurality of memory cells 220 (1, 1) to 220 (m, n) are provided in matrix of m rows (horizontal) and n columns (vertical) (m and n are natural numbers), transistors 235 (1, 1) to 235 (1, n) provided between the second wirings BL(1) to BL(n) and the memory cells 220 (1, 1) to 220 (1, n) along the sixth wiring SEL(1), transistors 235 (2, 1) to 235 (2, n) provided between the first wirings SL(1) to SL(n) and the memory cells 220 (m, 1) to 220 (m, n) along the sixth wiring SEL(2), and peripheral circuits such as a driver circuit 231 of the second wiring and the fourth wiring, a driver circuit 213 of the third wiring and the fifth wiring, and a reading circuit 232. A refresh circuit or the like may be provided as another peripheral circuit.

The semiconductor device in FIG. 14 is different from the semiconductor device in FIG. 11 in the directions of the third wiring S1 and the fourth wiring S2. In other words, semiconductor device in FIG. 14 has a structure in which the fourth wiring S2 and the third wiring S1 are provided along the second wiring BL (in a column direction) and the fifth wiring WL (in a row direction), respectively.

Each memory cell 220 (a specific example of which is the memory cell 220 (i, j), where i is an integer of 1 or more and m or less, and j is an integer of 1 or more and n or less) is connected to the third wiring S1(i), the fifth wiring WL(i), and the fourth wiring S2(j). Further, the drain electrodes of the transistors 201 and 203 included in the memory cell 220 (i₁, j) (i₁ is an integer of 2 to m) are connected to the source electrodes of the transistors 201 and 203 included in the memory cell 220 (i₁−1, j). In addition, the source electrodes of the transistors 201 and 203 included in the memory cell 220 (i₂, j) (i₂ is an integer of 1 to m−1) are connected to the drain electrodes of the transistors 201 and 203 included in the memory cell 220 (i₂+1, j). The drain electrodes of the transistors 201 and 203 included in the memory cell 200 (1, j) are connected to a source electrode of the transistor 235 (1, j). The source electrodes of the transistors 201 and 203 included in the memory cell 220 (m, j) are connected to a drain electrode of the transistor 235 (2, j). The drain electrode of the transistor 235 (1, j) is connected to the second wiring BL(j). The source electrode of the transistor 235 (2, j) is connected to the first wiring SL(j). A gate electrode of the transistor 235 (1, j) is connected to the sixth wiring SEL(1). The gate electrode of the transistor 235 (2, j) is connected to the sixth wiring SEL(2).

Further, the second wirings BL(1) to BL(n) and the fourth wirings S2(1) to S2(n) are connected to the driver circuit 231 of the second wiring and the fourth wiring. The fifth wirings WL(1) to WL(m), the third wirings S1(1) to S1(m), and the sixth wirings SEL(1) and SEL(2) are connected to the driver circuit 233 of the third wiring and the fifth wiring. In addition, the second wirings BL(1) to BL(n) are also connected to the reading circuit 232. The potential Vs is supplied to the first wirings SL(1) to SL(n). Note that the first wirings SL(1) to SL(n) are not necessarily separated and may be connected to each other.

The operation of the semiconductor device illustrated in FIG. 14 will be described. In this structure, writing is performed by column and reading is performed by row.

When writing is performed on the memory cells 220 (1, j) to 220 (m, j) in the j-th column, the fourth wiring S2(j) is supplied with 2 V in order to turn on the transistors 202 of the selected memory cells. On the other hand, the fourth wirings S2 except the fourth wiring S2(j) are supplied with 0 V in order to turn off the transistors 202 of the non-selected memory cells. Among the third wirings S1(1) to S1(n), a wiring of a row through which data “1” is written is supplied with 2 V while a row through which data “0” is written is supplied with 0 V. Note that, to finish writing, the fourth wiring S2(j) is supplied with 0 V before the potentials of the third wirings S1(1) to S1(m) are changed, so that the transistors 202 of the selected memory cells are turned off. As for the other wirings, for example, the potentials of the second wirings BL(1) to BL(n), the potentials of the fifth wirings WL(1) to WL (m), the potentials of the sixth wirings SEL(1) and SEL(2), and the potential Vs of the first wirings SL(1) to SL(n) are set to 0.

As a result, the potential of a node (hereinafter, referred to as a node A) connected to the gate electrode of the transistor 201 of the memory cell to which the data “1” has been written is approximately 2 V, and the potential of the node A of the memory cell to which the data “0” has been written is approximately 0 V. The potential of the node A of the non-selected memory cell is not changed. Here, the off-state current of the transistor 202 is extremely small or substantially zero, so that the potential of the gate electrode of the transistor 201 (node A) is held for a long time.

When the memory cells 220 (i, 1) to 220 (i, n) in the i-th row are read, the sixth wirings SEL(1) and SEL(2) are supplied with 2 V in order to turn on the transistors 235 (1, 1) to 235 (2, n). The potential Vs of the first wirings SL(1) to SL(n) is set to 0. The reading circuit 232 connected to the second wirings BL(1) to BL(n) is set to operate. The fourth wirings S2(1) to S2(n) are supplied with 0 V in order to turn off the all of the transistors 202 of the memory cells. The third wirings S1(1) to S1(m) are supplied with 0 V.

Then, the fifth wiring WL(i) is supplied with 0 V, and the fifth wirings WL except the fifth wiring WL(i) are supplied with 2 V. At this time, the transistors 203 of the memory cells in the i-th row are turned off. The transistors 203 of the memory cells which are not in the i-th row are turned on. As a result, the resistant/resistance state of the columns of memory cells is determined by the state of transistor 201 of the memory cells in the i-th row, an on state or an off state. In the memory cells which has the data “0” in the i-th row, the transistor 201 is turned off because the node A is supplied with approximately 0 V; therefore, the memory cell column is in a high-resistance state. On the other hand, in the memory cells which has the data “1” in the i-th row, the transistor 201 is turned on because the node A is supplied with approximately 2 V; therefore, the memory cell column is in a low-resistance state. As a result, the reading circuit 232 can read the data “0” and “1” by difference of the resistance states of the memory cells.

Note that in writing, in the case where the semiconductor device does not have a substrate potential such as the case where a thin film transistor is formed over an SOI substrate, it is preferable that the fifth wirings WL(1) to WL(m) and the sixth wiring SEL(1) or SEL(2) be supplied with 2 V. Thus, at least one of the source electrode and the drain electrode of the transistor 201 of the memory cell in the i-th row can be supplied with approximately 0 V. On the other hand, in the case where the semiconductor device has a substrate potential such as the case where a transistor is formed over a single crystal semiconductor substrate, the substrate potential may be set to be 0 V.

Note that the second wirings BL(1) to BL(n) are supplied with 0 V in writing in the above description; however, the second wirings BL(1) to BL(n) may be in a floating state or charged to have a potential of 0 V or more in the case where the sixth wiring SEL(1) is supplied with 0 V. The third wirings S1(1) to S1(n) are supplied with 0 V in reading; however, the third wirings S1(1) to S1(n) may be in a floating state or charged to have a potential of 0 V or more.

Note that the data “1” and the data “0” are defined for convenience and can be reversed. In addition, the above operation voltages are an example. An operation voltage may be determined so that the transistor 201 is in an off state when the data “0” is set to and in an on state when the data “1” is set to, so that the transistor 202 is in an on state in writing and in an off state otherwise, or so that the transistor 203 of the selected memory cell is in an off state in reading, and the transistor 203 of the non-selected memory cell is in an on state in reading. The power supply potential VDD of the peripheral logic circuit may be used instead of 2 V. In addition, the ground potential GND may be used instead of 0 V.

The semiconductor device according to this embodiment can store data for an extremely long time because the transistor 202 has low off-state current. That is, refresh operation which is necessary in a DRAM and the like is not needed, so that power consumption can be suppressed. Moreover, the semiconductor device according to this embodiment can be used as a substantially non-volatile memory device.

Since writing or the like of data is performed with switching operation of the transistor 202, high voltage is not necessary and deterioration of the element does not become a problem. Furthermore, data is written and erased depending on on state and off state of the transistor, whereby high-speed operation can be easily realized. In addition, it is possible to rewriting data directly by controlling a potential input to the transistor. Therefore, erasing operation which is necessary in a flash memory and the like is not necessary, so that a reduction in operation speed because of erasing operation can be prevented.

Since a transistor including a material which is not an oxide semiconductor can operate at sufficiently high speed, stored data can be read out at high speed by using the transistor.

Embodiment 3

In this embodiment, an example of a circuit configuration of a semiconductor device which is different from that in Embodiment 2 and operation thereof will be described.

FIG. 15 illustrates an example of a circuit diagram of a memory cell included in the semiconductor device. A memory cell 240 illustrated in FIG. 15 includes the third wiring S1, the fourth wiring S2, the fifth wiring WL, the transistor 201, the transistor 202, and a capacitor 204. The transistor 201 is formed using a material which is not an oxide semiconductor and the transistor 202 is formed using an oxide semiconductor. Here, the transistor 201 is preferably formed to have a structure similar to that of the transistor 160 in Embodiment 1. In addition, the transistor 202 is preferably formed to have a structure similar to that of the transistor 162 in Embodiment 1. Further, it is preferable that the memory cell 240 be electrically connected to the first wiring SL and the second wiring BL through a transistor (including a transistor in another memory cell).

Here, the gate electrode of the transistor 201, the one of the source electrode and the drain electrode of the transistor 202, and one electrode of the capacitor 204 are electrically connected to each other. In addition, the first wiring SL is electrically connected to the source electrode of the transistor 201, and the second wiring BL is electrically connected to the drain electrode of the transistor 201. Moreover, the third wiring S1, the fourth wiring S2, and the fifth wiring WL are electrically connected to the other of the source electrode and the drain electrode of the transistor 202, the gate electrode of the transistor 202, and the other electrode of the capacitor 204, respectively. Note that the first wiring SL may be electrically connected to the source electrode of the transistor 201 through a transistor (including a transistor in another memory cell). Furthermore, the second wiring BL may be electrically connected to the drain electrode of the transistor 201 through a transistor (including a transistor in another memory cell).

FIG. 16 illustrates a block circuit diagram of a semiconductor device according to one embodiment of the present invention, which includes m×n bits of memory capacitance. Here, as an example, a NAND semiconductor device in which the memory cells 240 are connected in series is shown.

The semiconductor device according to one embodiment of the present invention includes m fifth wirings WL, m fourth wirings S2, n first wirings SL, n second wirings BL, n third wirings S1, two sixth wirings SEL(1) and SEL(2), a memory cell array 250 in which a plurality of memory cells 240 (1, 1) to 240 (m, n) are provided in matrix of m rows (horizontal) and n columns (vertical) (m and n are natural numbers), transistors 255 (1, 1) to 255 (1, n) provided between the second wirings BL(1) to BL(n) and the memory cells 240 (1, 1) to 240 (1, n) along the sixth wiring SEL(1), transistors 255 (2, 1) to 255 (2, n) provided between the first wirings SL(1) to SL(n) and the memory cells 240 (m, 1) to 240 (m, n) along the sixth wiring SEL(2), and peripheral circuits such as a driver circuit 251 of the second wiring and the third wiring, a driver circuit 253 of the fourth wiring and the fifth wiring, and a reading circuit 252. A refresh circuit or the like may be provided as another peripheral circuit.

Each memory cell 240 (a specific example of which the memory cell 240 (i, j), where i is an integer of 1 or more and m or less, and j is an integer of 1 or more and n or less) is connected to the third wiring S1(j), the fourth wiring S2(i), and the fifth wiring WL(i). Further, the drain electrode of the transistor 201 included in the memory cell 240 (i₁, j) (i₁ is an integer of 2 to m) are connected to the source electrode of the transistor 201 included in the memory cell 240 (i₁−1, j). In addition, the source electrode of the transistor 201 included in the memory cell 240 (i₂,1) (i₂ is an integer of 1 to m−1) are connected to the drain electrode of the transistor 201 included in the memory cell 240 (i₂+1, 1). The drain electrode of the transistor 201 included in the memory cell 240 (1, j) is connected to a source electrode of the transistor 255 (1, j). The source electrode of the transistor 201 included in the memory cell 240 (m, j) is connected to a drain electrode of the transistor 255 (2, j). The drain electrode of the transistor 255 (1, j) is connected to the second wiring BL(j). The source electrode of the transistor 255 (2, j) is connected to the first wiring SL(j).

Further, the second wirings BL(1) to BL(n) and the third wirings S1(1) to S1(n) are connected to the driver circuit 251 of the second wirings and the third wirings. The fifth wirings WL(1) to WL(m), the fourth wirings S2(1) to S2(m), and the sixth wirings SEL(1) and SEL(2) are connected to the driver circuit 253 of the fourth wiring and the fifth wiring. In addition, the second wirings BL(1) to BL(n) are also connected to the reading circuit 252. The potential Vs is supplied to the first wirings SL(1) to SL(n). Note that the first wirings SL(1) to SL(n) are not necessarily separated and may be connected to each other.

The operation of the semiconductor device illustrated in FIG. 16 will be described. In this structure, writing and reading are performed by row.

When writing is performed on the memory cells 240 (i, 1) to 240 (i, n) in the i-th row, the fourth wiring S2(i) is supplied with 2 V in order to turn on the transistors 202 of the memory cells in the i-th row. On the other hand, the fourth wirings S2 except the fourth wiring S2(i) are supplied with 0 V in order to turn off the transistors 202 of the memory cells which are not in the i-th row. Among the third wirings S1(1) to S1(n), a wiring of a column through which data “1” is written is supplied with 2 V while a column through which data “0” is supplied with 0 V. Note that, to finish writing, the fourth wiring S2(i) is supplied with 0 V before the potentials of the third wirings S1(1) to S1(n) are changed, so that the transistors 202 of the selected memory cells are turned off. As for the other wirings, for example, the potentials of the second wirings BL(1) to BL(n), the potentials of the fifth wirings WL(1) to WL (m), the potentials of the sixth wirings SEL(1) and SEL(2), and the potential Vs of the first wirings SL(1) to SL(n) are set to 0.

As a result, the potential of a node (hereinafter, referred to as a node A) connected to the gate electrode of the transistor 201 of the memory cell to which the data “1” has been written is approximately 2 V, and the potential of the node A of the memory cell to which the data “0” has been written is approximately 0 V. The potential of the node A of the non-selected memory cell is not changed. Here, the off-state current of the transistor 202 is extremely small or substantially zero, so that the potential of the gate electrode of the transistor 201 (node A) is held for a long time.

When the memory cells 240 (i, 1) to 240 (i, n) in the i-th row are read, the sixth wirings SEL(1) and SEL(2) are supplied with 2 V in order to turn on the transistors 255 (1, 1) to 255 (2, n). The potential Vs of the first wirings SL(1) to SL(n) is set to 0. The reading circuit 252 connected to the second wirings BL(1) to BL(n) is set to operate. The fourth wirings S2(1) to S2(m) are supplied with 0 V in order to turn off the all of the transistors 202 of the memory cells. The third wirings S1(1) to S1(n) are supplied with 0 V.

Further, the fifth wiring WL (i) is supplied with 0 V and the fifth wirings except the fifth wiring WL (i) are supplied with 2 V. The state of the transistor 201 in the case where the fifth wiring WL (i) is supplied with 0 V and the fifth wirings except the fifth wiring WL (i) are supplied with 2 V is described here. The potential of the node A which determines the state of the transistor 201 is decided depending on capacitance C1 between the fifth wiring WL and the node A, and capacitance C2 between the gate of the transistor 201 and the source or the drain of the transistor 201. FIG. 17 illustrates a relationship between the potential of the fifth wiring WL and the potential of the node A. Here, as an example, C1/C2>>1 is satisfied when the transistor is in an off state and C1/C2=1 is satisfied when the transistor 201 is in an on state. In addition, the threshold voltage of the transistor 201 is 0.5 V. According to FIG. 17, when the potential of the fifth wiring WL is 0 V, the transistor 201 is turned off in a memory cell having data “0” because the node A is at approximately 0 V, and the transistor 201 is turned on in a memory cell having data “1” because the node A has approximately 2 V. On the other hand, when the potential of the fifth wiring WL is 2 V, the node A is at approximately 1.25 V in the memory cell having data “0” and the node A is at approximately 3 V in the memory cell having data “1”, so that the transistor 201 is turned on regardless of whether the data of the memory cell is “0” or “1”. Accordingly, in the case where the fifth wiring WL(i) is supplied with 0 V and the fifth wirings WL except the fifth wiring WL(i) are supplied with 2 V, a memory cell column in which the memory cell in the i-th row has data “0” is in a high resistance state and a memory cell column in which the memory cell in the i-th row has data “1” is in a low resistance state. The reading circuit 252 can read data “0” or “1” by difference between the resistance states of a memory cells.

Note that the second wirings BL(1) to BL(n) are supplied with 0 V in writing in the above description; however, the second wirings BL(1) to BL(n) may be in a floating state or charged to have a potential of 0 V or more in the case where the sixth wiring SEL(1) is supplied with 0 V. The third wirings S1(1) to S1(n) are supplied with 0 V in reading; however, the third wirings S1(1) to S1(n) may be in a floating state or charged to have a potential of 0 V or more.

Note that the data “1” and the data “0” are defined for convenience and can be reversed. In addition, the above operation voltages are merely examples. An operation voltage may be determined so that the transistor 202 is in an on state in writing and in an off state otherwise, or so that the transistor 201 of the selected memory cell having data “0” is in an off state in reading, the transistor 201 of the selected memory cell having data “1” is in an on state in reading, and the transistor 201 of the non-selected memory cell is in an on state in reading. The power supply potential VDD of the peripheral logic circuit may be used instead of 2 V. In addition, the ground potential GND may be used instead of 0 V.

Next, another example of a circuit configuration of a semiconductor device according to one embodiment of the present invention and operation thereof will be described.

FIG. 18 illustrates an example of a circuit diagram of a memory cell circuit included in the semiconductor device. A memory cell 260 illustrated in FIG. 18 includes the third wiring S1, the fourth wiring S2, the fifth wiring WL, the transistor 201, the transistor 202, and the capacitor 204. The transistor 201 is formed using a material which is not an oxide semiconductor and the transistor 202 is formed using an oxide semiconductor. Here, the transistor 201 is preferably formed to have a structure similar to that of the transistor 160 in Embodiment 1. In addition, the transistor 202 is preferably formed to have a structure similar to that of the transistor 162 in Embodiment 1. Further, it is preferable that the memory cell 260 be electrically connected to the first wiring SL and the second wiring BL through a transistor (including a transistor in another memory cell).

The memory cell circuit in FIG. 18 is different from the memory cell circuit in FIG. 15 in the directions of the third wiring S1 and the fourth wiring S2. In other words, the memory cell circuit in FIG. 18 has a structure in which the fourth wiring S2 and the third wiring S1 are provided along the second wiring BL (in a column direction) and the fifth wiring WL (in a row direction), respectively.

Further, a block circuit diagram of a semiconductor device according to one embodiment of the present invention, which includes m×n bits of memory capacitance, can be formed in such a manner that the memory cell 260 in FIG. 18 is employed as the memory cell of the block circuit diagram illustrated in FIG. 14. The driving voltage and timing of a driver circuit are set in accordance with operation of the memory cell 260. Thus, writing by column and reading by row can be performed as in the case of the block circuit diagram in FIG. 14.

The semiconductor device according to this embodiment can store data for an extremely long time because the transistor 202 has low off-state current. That is, refresh operation which is necessary in a DRAM and the like is not needed, so that power consumption can be suppressed. Moreover, the semiconductor device according to this embodiment can be used as a substantially non-volatile memory device.

Since writing or the like of data is performed with switching operation of the transistor 202, high voltage is not necessary and deterioration of the element does not become a problem. Furthermore, data is written and erased depending on on state and off state of the transistor, whereby high-speed operation can be easily realized. In addition, it is possible to rewriting data directly by controlling a potential input to the transistor. Therefore, erasing operation which is necessary in a flash memory and the like is not necessary, so that a reduction in operation speed because of erasing operation can be prevented.

Since a transistor including a material which is not an oxide semiconductor can operate at sufficiently high speed, stored data can be read out at high speed by using the transistor.

Embodiment 4

In this embodiment, an example of a circuit configuration of a semiconductor device which is different from that in Embodiment 2 or 3 and operation thereof will be described.

FIG. 19 illustrates an example of a circuit diagram of a memory cell circuit included in a semiconductor device according to one embodiment of the present invention.

A memory cell 280 in FIG. 19 includes a capacitor 205 between the node A and the first wiring SL in addition to the elements included in the memory cell circuit in FIG. 10. The capacitor 205 leads to improvement of a data storing characteristics.

Operation of the memory cell circuit in FIG. 19 is similar to that of the memory cell circuit in FIG. 10, so that detailed description thereof is omitted.

Embodiment 5

An example of a reading circuit included in a semiconductor device according to one embodiment of the present invention will be described with reference to FIG. 20.

A reading circuit illustrated in FIG. 20 includes a transistor 206 and a differential amplifier.

At the time of reading, a terminal A is connected to a second wiring connected to a memory cell from which data is read. Moreover, a voltage Vdd is applied to a drain electrode or a source electrode of the transistor 206, a bias voltage Vbias is applied to a gate electrode of the transistor 206, and a predetermined current flows through the transistor 206.

A memory cell has a different resistance corresponding to data “1” or data “0” stored therein. Specifically, when the transistor 201 in a selected memory cell is on, the memory cell has a low resistance; whereas when the transistor 201 in a selected memory cell is off, the memory cell has a high resistance.

When the memory cell has a high resistance, the potential of the terminal A is higher than a reference potential Vref and data “1” is output from an output of the differential amplifier. On the other hand, when the memory cell has a low resistance, the potential of the terminal A is lower than the reference potential Vref and data “0” is output from the output of the differential amplifier.

In such a manner, the reading circuit can read data from the memory cell. Note that the reading circuit in this embodiment is an example, and a known circuit may be used. For example, the reading circuit may include a precharge circuit. A second wiring for reference may be connected instead of the reference potential Vref. A latch-type sense amplifier may be used instead of the differential amplifier.

The structures and methods described in this embodiment can be combined as appropriate with any of the structures and methods described in the other embodiments.

Embodiment 6

In this embodiment, examples of electronic devices each including the semiconductor device according to any of the above-described embodiments will be described with reference to FIGS. 21A to 21F. The semiconductor device according to the above embodiment can store data even when power is not supplied. Moreover, degradation due to writing or erasing does not occur. Furthermore, the semiconductor device can operate at high speed. For these reasons, an electronic device with a novel structure can be provided by using the semiconductor device. Note that the semiconductor devices according to the above embodiment are integrated and mounted on a circuit board or the like, and placed inside an electronic device.

FIG. 21A illustrates a notebook personal computer including the semiconductor device according to the above embodiment. The notebook personal computer includes a main body 301, a housing 302, a display portion 303, a keyboard 304, and the like. The semiconductor device according to one embodiment of the present invention is applied to a notebook personal computer, whereby the notebook personal computer can store data even when power is not supplied. Moreover, degradation due to writing or erasing does not occur. Further, the notebook personal computer can operate at high speed. For these reasons, it is appropriate to apply the semiconductor device according to one embodiment of the present invention to a notebook personal computer.

FIG. 21B illustrates a personal digital assistant (PDA) including the semiconductor device according to the above embodiment. A main body 311 is provided with a display portion 313, an external interface 315, operation buttons 314, and the like. A stylus 312 that is an accessory is used for operating the PDA. The semiconductor device according to one embodiment of the present invention is applied to a PDA, whereby the PDA can store data even when power is not supplied.

Moreover, degradation due to writing or erasing does not occur. Further, the PDA can operate at high speed. For these reasons, it is appropriate to apply the semiconductor device according to one embodiment of the present invention to a PDA.

FIG. 21C illustrates an e-book reader 320 as an example of electronic paper including the semiconductor device according to the above embodiment. The e-book reader 320 includes two housings: a housing 321 and a housing 323. The housing 321 and the housing 323 are combined with a hinge 337 so that the e-book reader 320 can be opened and closed with the hinge 337 as an axis. With such a structure, the e-book reader 320 can be used like a paper book. The semiconductor device according to one embodiment of the present invention is applied to electronic paper, whereby the electronic paper can hold data even when power is not supplied. Moreover, degradation due to writing or erasing does not occur. Further, the electronic paper can operate at high speed. For these reasons, it is appropriate to apply the semiconductor device according to one embodiment of the present invention to electronic paper.

A display portion 325 is incorporated in the housing 321 and a display portion 327 is incorporated in the housing 323. The display portion 325 and the display portion 327 may display one image or different images. When the display portion 325 and the display portion 327 display different images, for example, the right display portion (the display portion 325 in FIG. 21C) can display text and the left display portion (the display portion 327 in FIG. 21C) can display images.

FIG. 21C illustrates an example in which the housing 321 is provided with an operation portion and the like. For example, the housing 321 is provided with a power switch 331, operation keys 333, a speaker 335, and the like. Pages can be turned with the operation key 333. Note that a keyboard, a pointing device, or the like may also be provided on the surface of the housing, on which the display portion is provided. Furthermore, an external connection terminal (e.g., an earphone terminal, a USB terminal, or a terminal that can be connected to various cables such as an AC adapter and a USB cable), a recording medium insertion portion, and the like may be provided on the back surface or the side surface of the housing. Further, the e-book reader 320 may have a function of an electronic dictionary.

The e-book reader 320 may send and receive data wirelessly. Through wireless communication, desired book data or the like can be purchased and downloaded from an electronic book server.

Note that electronic paper can be applied to devices in a variety of fields as long as they display information. For example, electronic paper can be used for posters, advertisement in vehicles such as trains, display in a variety of cards such as credit cards, and the like in addition to e-book readers.

FIG. 21D illustrates a mobile phone including the semiconductor device according to the above embodiment. The mobile phone includes two housings: a housing 340 and a housing 341. The housing 341 is provided with a display panel 342, a speaker 343, a microphone 344, a pointing device 346, a camera lens 347, an external connection terminal 348, and the like. The housing 340 is provided with a solar cell 349 for charging the mobile phone, an external memory slot 350, and the like. In addition, an antenna is incorporated in the housing 341. The semiconductor device according to one embodiment of the present invention is applied to a mobile phone, whereby the mobile phone can hold data even when power is not supplied. Moreover, degradation due to writing or erasing does not occur. Further, the mobile phone can operate at high speed. For these reasons, it is appropriate to apply the semiconductor device according to one embodiment of the present invention to a mobile phone.

The display panel 342 has a touch panel function. A plurality of operation keys 345 displayed as images are shown by dashed lines in FIG. 21D. Note that the mobile phone includes a booster circuit for boosting a voltage output from the solar cell 349 to a voltage necessary for each circuit. Moreover, the mobile phone can include a contactless IC chip, a small recording device, or the like in addition to the above structure.

The direction of display on the display panel 342 is changed as appropriate depending on applications. Further, the camera lens 347 is provided on the same surface as the display panel 342, so that the mobile phone can be used as a videophone. The speaker 343 and the microphone 344 can be used for videophone calls, recording and playing sound, and the like as well as voice calls. Moreover, the housings 340 and 341 in a state where they are developed as illustrated in FIG. 21D can be slid so that one is lapped over the other. Therefore, the size of the mobile phone can be reduced, which makes the mobile phone suitable for being carried.

The external connection terminal 348 can be connected to a variety of cables such as an AC adapter or a USB cable, so that the mobile phone can be charged or can perform data communication. Moreover, the mobile phone can store and move a larger amount of data by inserting a recording medium into the external memory slot 350. Further, the mobile phone may have an infrared communication function, a television reception function, or the like in addition to the above functions.

FIG. 21E illustrates a digital camera including the semiconductor device according to the above embodiment. The digital camera includes a main body 361, a display portion (A) 367, an eyepiece portion 363, an operation switch 364, a display portion (B) 365, a battery 366, and the like. The semiconductor device according to one embodiment of the present invention is applied to a digital camera, whereby the digital camera can hold data even when power is not supplied. Moreover, degradation due to writing or erasing does not occur. Further, the digital camera can operate at high speed. For these reasons, it is appropriate to apply the semiconductor device according to one embodiment of the present invention to a digital camera.

FIG. 21F illustrates a television set including the semiconductor device according to the above embodiment. In a television set 370, a display portion 373 is incorporated in a housing 371. Images can be displayed on the display portion 373. Here, the housing 371 is supported by a stand 375.

The television set 370 can be operated by an operation switch of the housing 371 or a separate remote controller 380. With operation keys 379 of the remote controller 380, channels and volume can be controlled and images displayed on the display portion 373 can be controlled. Moreover, the remote controller 380 may include a display portion 377 for displaying data output from the remote controller 380. The semiconductor device according to one embodiment of the present invention is applied to a television set, whereby the television set can hold data even when power is not supplied. Moreover, degradation due to writing or erasing does not occur. Furthermore, the television set can operate at high speed. For these reasons, it is appropriate to apply the semiconductor device according to one embodiment of the present invention to a television set.

Note that the television set 370 is preferably provided with a receiver, a modem, and the like. A general television broadcast can be received with the receiver. Moreover, when the television set is connected to a communication network with or without wires via the modem, one-way (from a sender to a receiver) or two-way (between a sender and a receiver or between receivers) data communication can be performed.

The structures and methods described in this embodiment can be combined as appropriate with any of the structures and methods described in the other embodiments.

This application is based on Japanese Patent Application serial no. 2009-251275 filed with the Japan Patent Office on Oct. 30, 2009, the entire contents of which are hereby incorporated by reference. 

1. (canceled)
 2. A semiconductor device comprising: a first transistor comprising silicon in a channel formation region; and a second transistor comprising an oxide semiconductor layer in a channel formation region, wherein a first insulating layer is over the gate electrode of the first transistor, wherein a first conductive layer is over the first insulating layer and electrically connected to one of a source and a drain of the second transistor, wherein the oxide semiconductor layer is over the first insulating layer and in contact with a top surface of the first conductive layer, wherein a second insulating layer is over the oxide semiconductor layer, wherein a second conductive layer is over the second insulating layer and electrically connected to the first conductive layer through a first opening of the second insulating layer, wherein the second conductive layer is electrically connected to the gate electrode of the first transistor through an opening of the first insulating layer and a second opening of the second insulating layer, and wherein a third conductive layer is over the second insulating layer and electrically connected to one of a source and a drain of the first transistor.
 3. The semiconductor device according to claim 2, wherein the silicon is a single crystal silicon.
 4. The semiconductor device according to claim 2, wherein the oxide semiconductor layer and the second opening of the second insulating layer do not overlap each other.
 5. The semiconductor device according to claim 2, further comprising a capacitor electrically connected to a gate electrode of the first transistor. 